DF2506BR26DV Renesas Electronics America, DF2506BR26DV Datasheet - Page 758

• Manufacturer Part Number: DF2506BR26DV
• Description: IC H8S/2506 MCU FLASH 176-LFBGA
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2500r

Specifications of DF2506BR26DV

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 26MHz
• Connectivity: I²C, SCI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 104
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 176-LFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 20 Flash Memory
(m) The return value in the programming program, FPFR (general register R0L) is determined.
(n) Determine whether programming of the necessary data has finished.
(o) After programming finishes, clear FKEY and specify software protection.
(3)
The procedures for download, initialization, and erasing are shown in figure 20.12.
Rev. 6.00 Sep. 24, 2009 Page 710 of 928
REJ09B0099-0600
⎯ Since the stack area is used in the programming program, a stack area of a maximum 128
If more than 128 bytes of data are to be programmed, specify FMPAR and FMPDR in 128-
byte units, and repeat steps (l) to (n). Increment the programming destination address by 128
bytes and update the programming data pointer correctly. If an address which has already been
programmed is written to again, not only will a programming error occur, but also flash
memory will be damaged.
If this LSI is restarted by a power-on reset immediately after user MAT programming has
finished, secure a reset period (period of RES = 0) of 100 μs or longer, which is longer than
usual.
Erasing Procedure in User Program Mode
bytes must be allocated in RAM