DF2506BR26DV Renesas Electronics America, DF2506BR26DV Datasheet - Page 773

IC H8S/2506 MCU FLASH 176-LFBGA

DF2506BR26DV

Manufacturer Part Number
DF2506BR26DV
Description
IC H8S/2506 MCU FLASH 176-LFBGA
Manufacturer
Renesas Electronics America
Series
H8® H8S/2500r
Datasheets

Specifications of DF2506BR26DV

Core Processor
H8S/2000
Core Size
16-Bit
Speed
26MHz
Connectivity
I²C, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
104
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
176-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2506BR26DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Note: Switching FMATS by a program in the on-chip RAM enables this area to be used.
Item
Operation for
Settings of Erasure
Parameter
Execution of
Erasure
Determination of
Erasure Result
Operation for
Erasure Error
Operation for FKEY
Clear
Switching MATs
by FMATS
On-Chip
RAM
Storable/Executable Area
User Boot
MAT
×*
×
×
×
×
×
User MAT
Rev. 6.00 Sep. 24, 2009 Page 725 of 928
User Boot
MAT
Selected MAT
Section 20 Flash Memory
Embedded Program
Storage Area
REJ09B0099-0600

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