DF2506BR26DV Renesas Electronics America, DF2506BR26DV Datasheet - Page 942

IC H8S/2506 MCU FLASH 176-LFBGA

DF2506BR26DV

Manufacturer Part Number
DF2506BR26DV
Description
IC H8S/2506 MCU FLASH 176-LFBGA
Manufacturer
Renesas Electronics America
Series
H8® H8S/2500r
Datasheets

Specifications of DF2506BR26DV

Core Processor
H8S/2000
Core Size
16-Bit
Speed
26MHz
Connectivity
I²C, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
104
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 16x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
176-LFBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2506BR26DV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 24 Electrical Characteristics
Rev. 6.00 Sep. 24, 2009 Page 894 of 928
REJ09B0099-0600
φ
A23 to A0
CS0
AS
RD
(read)
D15 to D0
(read)
φ
BREQ
BACK
A23 to A0,
CS7 to CS0*,
AS, RD,
HWR, LWR
Note: * CS1 and CS2 are not supported in the H8S/2556 Group.
Figure 24.12 Burst ROM Access Timing: Two-State Access
t
BRQS
Figure 24.13 External Bus-Released Timing
T
1
T
t
BZD
2
or T
3
t
BACD
t
AD
t
AS
T
1
t
ASD
t
t
ACC3
BRQS
t
ASD
T
2
t
RDS
t
AH
t
BACD
t
RDH
t
RSD2
t
BZD

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