MMC2114CFCAG33 Freescale Semiconductor, MMC2114CFCAG33 Datasheet - Page 28

• Manufacturer Part Number: MMC2114CFCAG33
• Description: IC MCU 32BIT 33MHZ 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: MCorer

Specifications of MMC2114CFCAG33

• Core Processor: M210
• Core Size: 32-Bit
• Speed: 33MHz
• Connectivity: EBI/EMI, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 67
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: MMC2114
• Core: M-CORE
• Data Bus Width: 32 bit
• Data Ram Size: 32 KB
• Interface Type: SCI/SPI
• Maximum Clock Frequency: 33 MHz
• Number Of Programmable I/os: 104
• Number Of Timers: 2
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• Controller Family/series: MCORE
• No. Of I/o's: 104
• Ram Memory Size: 32KB
• Cpu Speed: 33MHz
• No. Of Timers: 2
• Embedded Interface Type: SCI, SPI
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Table of Contents
Advance Information
28
22.14.12.5 Processor Status Register . . . . . . . . . . . . . . . . . . . . . . .605
22.14.13 Instruction Address FIFO Buffer (PC FIFO) . . . . . . . . . . . . 606
22.14.14 Reserved Test Control Registers . . . . . . . . . . . . . . . . . . . . 607
22.14.15 Serial Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 607
22.14.16 OnCE Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 608
22.14.17 Target Site Debug System Requirements . . . . . . . . . . . . . 608
22.14.18 Interface Connector for JTAG/OnCE Serial Port . . . . . . . . 608
23.1
23.2
23.3
23.4
23.5
23.6
23.7
23.8
23.9
23.10 FLASH Memory Characteristics . . . . . . . . . . . . . . . . . . . . . . .624
23.11 External Interface Timing Characteristics . . . . . . . . . . . . . . . . 625
23.12 General Purpose I/O Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 630
23.13 Reset and Configuration Override Timing . . . . . . . . . . . . . . . 631
23.14 SPI Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 632
23.15 OnCE, JTAG, and Boundary Scan Timing . . . . . . . . . . . . . . . 635
24.2
24.3
24.4
24.5
24.6
24.7
Freescale Semiconductor, Inc.
For More Information On This Product,
Section 23. Preliminary Electrical Specifications
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 611
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 612
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . 613
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 614
Junction Temperature Determination . . . . . . . . . . . . . . . . . . .614
Electrostatic Discharge (ESD) Protection . . . . . . . . . . . . . . . . 615
DC Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 616
PLL Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . 618
QADC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . .620
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 639
Bond Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 640
Package Information for the 144-Pin LQFP . . . . . . . . . . . . . . 641
Package Information for the 100-Pin LQFP . . . . . . . . . . . . . . 641
Package Information for the 196-Ball MAPBGA . . . . . . . . . . . 642
144-Pin LQFP Mechanical Drawing . . . . . . . . . . . . . . . . . . . . 643
Section 24. Mechanical Specifications
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MMC2114 • MMC2113 • MMC2112 — Rev. 1.0
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