MMC2114CFCAG33 Freescale Semiconductor, MMC2114CFCAG33 Datasheet - Page 43

• Manufacturer Part Number: MMC2114CFCAG33
• Description: IC MCU 32BIT 33MHZ 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: MCorer

Specifications of MMC2114CFCAG33

• Core Processor: M210
• Core Size: 32-Bit
• Speed: 33MHz
• Connectivity: EBI/EMI, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 67
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: MMC2114
• Core: M-CORE
• Data Bus Width: 32 bit
• Data Ram Size: 32 KB
• Interface Type: SCI/SPI
• Maximum Clock Frequency: 33 MHz
• Number Of Programmable I/os: 104
• Number Of Timers: 2
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• Controller Family/series: MCORE
• No. Of I/o's: 104
• Ram Memory Size: 32KB
• Cpu Speed: 33MHz
• No. Of Timers: 2
• Embedded Interface Type: SCI, SPI
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

MMC2114 • MMC2113 • MMC2112 — Rev. 1.0
MOTOROLA
Table
23-1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . 613
23-2 Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 614
23-3 ESD Protection Characteristics . . . . . . . . . . . . . . . . . . . . . . .615
23-4 DC Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . 616
23-5 PLL Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . 618
23-6 QADC Absolute Maximum Ratings. . . . . . . . . . . . . . . . . . . . . 620
23-7 QADC Electrical Specifications (Operating) . . . . . . . . . . . . . .621
23-8 QADC Conversion Specifications (Operating) . . . . . . . . . . . . 622
23-9 SGFM FLASH Program and Erase Characteristics . . . . . . . . 624
23-10 SGFM FLASH Module Life Characteristics . . . . . . . . . . . . . . 624
23-11 External Interface Timing Characteristics . . . . . . . . . . . . . . . 625
23-12 GPIO Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 630
23-13 Reset and Configuration Override Timing . . . . . . . . . . . . . . . 631
23-14 SPI Timing Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . 632
23-15 OnCE, JTAG, and Boundary Scan Timing . . . . . . . . . . . . . . . 635
25-1 MC Order Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .647
Freescale Semiconductor, Inc.
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Go to: www.freescale.com
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Advance Information
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