MMC2114CFCAG33 Freescale Semiconductor, MMC2114CFCAG33 Datasheet - Page 45

• Manufacturer Part Number: MMC2114CFCAG33
• Description: IC MCU 32BIT 33MHZ 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: MCorer

Specifications of MMC2114CFCAG33

• Core Processor: M210
• Core Size: 32-Bit
• Speed: 33MHz
• Connectivity: EBI/EMI, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 67
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Processor Series: MMC2114
• Core: M-CORE
• Data Bus Width: 32 bit
• Data Ram Size: 32 KB
• Interface Type: SCI/SPI
• Maximum Clock Frequency: 33 MHz
• Number Of Programmable I/os: 104
• Number Of Timers: 2
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 8-ch x 10-bit
• Controller Family/series: MCORE
• No. Of I/o's: 104
• Ram Memory Size: 32KB
• Cpu Speed: 33MHz
• No. Of Timers: 2
• Embedded Interface Type: SCI, SPI
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

1.1 Contents
1.2 Introduction
MMC2114 • MMC2113 • MMC2112 — Rev. 1.0
MOTOROLA
Advance Information — MMC2114, MMC2113, and MMC2112
1.2
1.3
1.4
The MMC2114, MMC2113, and MMC2112 are members of a family of
general-purpose microcontrollers (MCU) based on the M•CORE M210
central processor unit (CPU).
These are low-voltage devices that operate between 2.7 volts and
3.6 volts. They are well suited for use in battery-powered applications.
The maximum operating frequency is 33 MHz over a temperature range
of –40 C to 85 C.
Available packages are:
Table 1-1
operating modes of the MMC2112, MMC2113, and MMC2114.
•
•
•
Freescale Semiconductor, Inc.
For More Information On This Product,
100-pin low-profile quad flat pack (LQFP) for single-chip mode
operation
144-pin LQFP for applications requiring an external memory
interface or a large number of general-purpose inputs/outputs
(GPIO)
196-ball plastic mold array process ball grid array (MAPBGA)
providing the same functionality as the 144-pin LQFP in a smaller
form factor
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
summarizes the memory sizes, package options, and
Go to: www.freescale.com
General Description
Section 1. General Description
Advance Information
45