UPD78F0550MA-FAA-AX Renesas Electronics America, UPD78F0550MA-FAA-AX Datasheet - Page 712
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UPD78F0550MA-FAA-AX
Manufacturer Part Number
UPD78F0550MA-FAA-AX
Description
MCU 8BIT 16-SSOP
Manufacturer
Renesas Electronics America
Series
78K0/Kx2-Lr
Datasheet
1.UPD78F0550MA-FAA-AX.pdf
(734 pages)
Specifications of UPD78F0550MA-FAA-AX
Package / Case
*
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Speed
10MHz
Number Of I /o
12
Core Processor
78K/0
Program Memory Type
FLASH
Ram Size
384 x 8
Program Memory Size
4KB (4K x 8)
Data Converters
A/D 4x10b
Oscillator Type
Internal
Peripherals
LVD, POR, PWM, WDT
Connectivity
I²C, LIN, UART/USART
Core Size
8-Bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
UPD78F0550MA-FAA-AX
Manufacturer:
Renesas
Quantity:
800
Part Number:
UPD78F0550MA-FAA-AX
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
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Note
Cautions 1.
712
Infrared reflow
Partial heating
Soldering Method
These products should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, please contact an NEC Electronics
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
After opening the dry pack, store it at 25 C or less and 65% RH or less for the allowable storage period.
2.
CHAPTER 30 RECOMMENDED SOLDERING CONDITIONS (PRELIMINARY)
Do not use different soldering methods together (except for partial heating).
The 78K0/Kx2-L microcontrollers have an on-chip debug function, which is provided for
development and evaluation. Do not use the on-chip debug function in products designated for
mass production, because the guaranteed number of rewritable times of the flash memory may
be exceeded when this function is used, and product reliability therefore cannot be guaranteed.
NEC Electronics is not liable for problems occurring when the on-chip debug function is used.
Package peak temperature: 260 C, Time: 60 seconds max. (at 220 C or higher),
Count: 3 times or less, Exposure limit: 7 days
20 to 72 hours)
Pin temperature: 350 C max., Time: 3 seconds max. (per pin row)
Table 30-1. Surface Mounting Type Soldering Conditions
Preliminary User’s Manual U19111EJ2V1UD
Soldering Conditions
Note
(after that, prebake at 125 C for
IR60-207-3
Condition Symbol
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