UPD78F0550MA-FAA-AX Renesas Electronics America, UPD78F0550MA-FAA-AX Datasheet - Page 712

• Manufacturer Part Number: UPD78F0550MA-FAA-AX
• Description: MCU 8BIT 16-SSOP
• Manufacturer: Renesas Electronics America
• Series: 78K0/Kx2-Lr

Specifications of UPD78F0550MA-FAA-AX

• Package / Case: *
• Voltage - Supply (vcc/vdd): 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Speed: 10MHz
• Number Of I /o: 12
• Core Processor: 78K/0
• Program Memory Type: FLASH
• Ram Size: 384 x 8
• Program Memory Size: 4KB (4K x 8)
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Peripherals: LVD, POR, PWM, WDT
• Connectivity: I²C, LIN, UART/USART
• Core Size: 8-Bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

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Note
Cautions 1.
712
Infrared reflow
Partial heating
Soldering Method
These products should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, please contact an NEC Electronics
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
After opening the dry pack, store it at 25 C or less and 65% RH or less for the allowable storage period.
2.
CHAPTER 30 RECOMMENDED SOLDERING CONDITIONS (PRELIMINARY)
Do not use different soldering methods together (except for partial heating).
The 78K0/Kx2-L microcontrollers have an on-chip debug function, which is provided for
development and evaluation. Do not use the on-chip debug function in products designated for
mass production, because the guaranteed number of rewritable times of the flash memory may
be exceeded when this function is used, and product reliability therefore cannot be guaranteed.
NEC Electronics is not liable for problems occurring when the on-chip debug function is used.
Package peak temperature: 260 C, Time: 60 seconds max. (at 220 C or higher),
Count: 3 times or less, Exposure limit: 7 days
20 to 72 hours)
Pin temperature: 350 C max., Time: 3 seconds max. (per pin row)
Table 30-1. Surface Mounting Type Soldering Conditions
Preliminary User’s Manual U19111EJ2V1UD
Soldering Conditions
Note
(after that, prebake at 125 C for
IR60-207-3
Condition Symbol
Recommended