SC1200UFH-266 AMD (ADVANCED MICRO DEVICES), SC1200UFH-266 Datasheet - Page 437

• Manufacturer Part Number: SC1200UFH-266
• Manufacturer: AMD (ADVANCED MICRO DEVICES)

Specifications of SC1200UFH-266

• Operating Temperature (min): 0C
• Operating Temperature (max): 85C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Lead Free Status / Rohs Status: Not Compliant

Package Specifications
10.1
The junction-to-case thermal resistance (θ
ages shown in Table 10-1 can be used to calculate the
junction (die) temperature under any given circumstance.
Note that there is no specification for maximum junction
temperature given since the operation of the device is
guaranteed to a case temperature range of 0°C to 85°C
(see Table 9-3 on page 366). As long as the case tempera-
ture of the device is maintained within this range, the junc-
tion temperature of the die will also be maintained within its
allowable operating range. However, the die (junction) tem-
perature under a given operating condition can be calcu-
lated by using the following equation:
where:
T
T
P = Maximum power dissipation (W)
θ
These examples are given for reference only. The actual
value used for maximum power (P) and ambient tempera-
ture (T
system configuration, extremes of the operating environ-
ment, and whether active thermal management (via Sus-
pend Modulation) of the GX1 module is employed.
AMD Geode™ SC1200/SC1201 Processor Data Book
JC
J
C
Core Voltage
= Junction temperature (°C)
= Case temperature at top center of package (°C)
(Nominal)
= Junction-to-case thermal resistance (°C/W)
(V
A
1.8V
CORE
) is determined by the system designer based on
T
Thermal Characteristics
J
Package
BGU481
= T
)
C
Table 10-1. θ
+ (P * θ
Frequency
Table 10-2. Case-to-Ambient Thermal Resistance Example @ 85°C
266 MHz
Core
JC
)
JC
(×C/W)
Power (W)
Maximum
Max (°C/W)
3.32
JC
5
) of the pack-
10.0Package Specifications
19.58
20°C
θ
CA
A maximum junction temperature is not specified since a
maximum case temperature is. Therefore, the following
equation can be used to calculate the maximum thermal
resistance required of the thermal solution for a given max-
imum ambient temperature:
where:
θ
allowed for thermal solution
θ
allowed for thermal solution
T
T
P
If thermal grease is used between the case and heatsink,
θ
equation can be simplified to:
where:
θ
(°C/W) allowed for thermal solution
The calculated θ
represents the maximum allowed thermal resistance of the
selected cooling solution which is required to maintain the
maximum T
application in which the device is used.
CS
SA
A
CS
CA
C
for Different Ambient Temperatures (°C/W)
= Max ambient temperature (°C)
= Max heatsink-to-ambient thermal resistance (°C/W)
= Max case temperature at top center of package (°C)
= Maximum power dissipation (W)
will reduce to about 0.01 °C/W. Therefore, the above
= θ
= Max case-to-heatsink thermal resistance (°C/W)
18.07
25°C
SA
θ
θ
CS
CA
= Max heatsink-to-ambient thermal resistance
CASE
+ θ
=
SA
CA
(shown in Table 9-3 on page 366) for the
=
16.57
30°C
value (examples shown in Table 10-2)
T
T
C
C
10
P
P
− T
− T
32579B
A
A
15.06
35°C
13.55
40°C
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