XC3S400-4FT256C Xilinx Inc, XC3S400-4FT256C Datasheet - Page 119

• Manufacturer Part Number: XC3S400-4FT256C
• Description: SEMI CONDUCTOR
• Manufacturer: Xilinx Inc

Specifications of XC3S400-4FT256C

• Case: BGA
• Dc: 04+

Selecting the Right Package Option
Spartan-3 FPGAs are available in both quad-flat pack
(QFP) and ball grid array (BGA) packaging options. While
QFP packaging offers the lowest absolute cost, the BGA
Table 81: Comparing Spartan-3 Packaging Options
Mechanical Drawings
Detailed mechanical drawings for each package type are
available from the Xilinx website at the specified location in
Table
Table 82: Xilinx Package Mechanical Drawings
DS099-4 (v2.2) May 25, 2007
Product Specification
Maximum User I/O
Packing Density (Logic/Area)
Signal Integrity
Simultaneous Switching Output (SSO) Support
Thermal Dissipation
Minimum Printed Circuit Board (PCB) Layers
Hand Assembly/Rework
82.
FG1156 / FGG1156
R
VQ100 / VQG100
PQ208 / PQG208
TQ144 / TQG144
FG320 / FGG320
FG456 / FGG456
FG676 / FGG676
CP132/ CPG132
FG900 /FGG900
FT256 / FTG256
Package
Characteristic
www.xilinx.com
Quad Flat-Pack (QFP)
http://www.xilinx.com/bvdocs/packages/fg1156.pdf
http://www.xilinx.com/bvdocs/packages/vq100.pdf
http://www.xilinx.com/bvdocs/packages/cp132.pdf
http://www.xilinx.com/bvdocs/packages/pq208.pdf
http://www.xilinx.com/bvdocs/packages/tq144.pdf
http://www.xilinx.com/bvdocs/packages/fg320.pdf
http://www.xilinx.com/bvdocs/packages/fg456.pdf
http://www.xilinx.com/bvdocs/packages/fg676.pdf
http://www.xilinx.com/bvdocs/packages/fg900.pdf
http://www.xilinx.com/bvdocs/packages/ft256.pdf
packages are superior in almost every other aspect, as
summarized in
using BGA packaging whenever possible.
Material Declaration Data Sheets (MDDS) are also avail-
able on the
Possible
Limited
Good
141
Fair
Fair
4
Web Link (URL)
Spartan-3 FPGA Family: Pinout Descriptions
Xilinx website
Table
81. Consequently, Xilinx recommends
for each package.
Ball Grid Array (BGA)
Very Difficult
Better
Better
Better
Better
784
6
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