XC3S400-4FT256C Xilinx Inc, XC3S400-4FT256C Datasheet - Page 7

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XC3S400-4FT256C

Manufacturer Part Number
XC3S400-4FT256C
Description
SEMI CONDUCTOR
Manufacturer
Xilinx Inc
Datasheet

Specifications of XC3S400-4FT256C

Case
BGA
Dc
04+

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Package Marking
Figure 2
quad-flat packages.
Spartan-3 FPGAs in BGA packages except the 132-ball
chip-scale package (CP132 and CPG132). The markings
for the BGA packages are nearly identical to those for the
quad-flat packages, except that the marking is rotated with
respect to the ball A1 indicator.
DS099-1 (v2.2) May 25, 2007
Product Specification
shows the top marking for Spartan-3 FPGAs in the
R
Figure 3: Spartan-3 BGA Package Marking Example for Part Number XC3S1000-4FT256C
Figure 4: Spartan-3 CP132 and CPG132 Package Marking Example for XC3S50-4CP132C
Figure 2: Spartan-3 QFP Package Marking Example for Part Number XC3S400-4PQ208C
Figure 3
Temperature Range
Temperature Range
shows the top marking for
Speed Grade
Device Type
Figure 4
Speed Grade
Device Type
Package
BGA Ball A1
Mask Revision Code
Package
Pin P1
Lot Code
Package
C5 = CP132
C6 = CPG132
Ball A1
shows the top
SPARTAN
XC3S400
PQ208EGQ0525
D1234567A
4C
www.xilinx.com
SPARTAN
XC3S1000
FT256EGQ0525
D1234567A
4C
Spartan-3 FPGA Family: Introduction and Ordering Information
F1234567-0525
PHILIPPINES
C5EGQ
R
TM
R
marking for Spartan-3 FPGAs in the CP132 and CPG132
packages. Using the seven digits of the Lot Code, look up
additional information for a specific device using the Xilinx
Genealogy
The “5C” and “4I” part combinations may be dual marked
as “5C/4I”.
Process Code
Fabrication Code
TM
R
R
3S50
4C
Viewer.
Device Type
Date Code
Temperature Range
Speed Grade
Mask Revision Code
Fabrication Code
Process Code
Date Code
Lot Code
Mask Revision Code
Fabrication Code
Process Technology
Date Code
Lot Code
DS099-1_05_050305
DS099-1_04_050305
DS099-1_03_050305
7

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