XC3S400-4FT256C Xilinx Inc, XC3S400-4FT256C Datasheet - Page 122

• Manufacturer Part Number: XC3S400-4FT256C
• Description: SEMI CONDUCTOR
• Manufacturer: Xilinx Inc

Specifications of XC3S400-4FT256C

• Case: BGA
• Dc: 04+

Spartan-3 FPGA Family: Pinout Descriptions
Package Thermal Characteristics
The power dissipated by an FPGA application has implica-
tions on package selection and system design. The power
consumed by a Spartan-3 FPGA is reported using either
the
grated in the Xilinx ISE development software.
provides the thermal characteristics for the various Spar-
tan-3 package offerings.
The junction-to-case thermal resistance (θ
difference between the temperature measured on the pack-
Table 85: Spartan-3 Package Thermal Characteristics
122
Package
FG1156
VQ100
PQ208
CP132
TQ144
FG320
FG456
FG676
FG900
FT256
Web Power Tool
XC3S50
XC3S200
XC3S50
XC3S50
XC3S200
XC3S400
XC3S50
XC3S200
XC3S400
XC3S200
XC3S400
XC3S1000
XC3S400
XC3S1000
XC3S1500
XC3S400
XC3S1000
XC3S1500
XC3S2000
XC3S1000
XC3S1500
XC3S2000
XC3S4000
XC3S2000
XC3S4000
XC3S5000
XC3S4000
XC3S5000
Device
estimator or the
Junction-to-
Case (θ
12.2
14.5
11.0
11.2
9.8
7.8
6.5
6.0
8.4
7.3
9.5
7.6
6.0
9.8
7.9
8.1
6.7
4.8
3.7
6.3
4.9
4.1
3.7
3.7
3.2
2.9
1.9
1.9
XPower
JC
)
JC
calculator inte-
) indicates the
Junction-to-
Board (θ
32.7
21.9
18.4
15.3
15.1
13.4
10.7
13.1
10.9
Table 85
11.0
8.3
6.6
9.1
7.9
7.3
7.0
6.4
5.9
-
-
-
-
-
-
-
-
-
-
www.xilinx.com
JB
)
age body (case) and the die junction temperature per watt
of power consumption. The junction-to-board (θ
similarly reports the difference between the board and junc-
tion temperature. The junction-to-ambient (θ
reports the temperature difference per watt between the
ambient environment and the junction temperature. The θ
value is reported at different air velocities, measured in lin-
ear feet per minute (LFM). The “Still Air (0 LFM)” column
shows the θ
resistance drops with increasing air flow.
(0 LFM)
Still Air
46.6
39.9
53.0
41.4
34.1
32.5
37.5
36.1
35.3
30.9
27.9
25.3
24.4
22.7
20.3
20.6
19.5
18.3
17.7
18.1
16.7
15.6
15.0
14.3
13.6
13.1
14.7
14.5
Junction-to-Ambient (θ
at Different Air Flows
JA
250 LFM
value in a system without a fan. The thermal
38.7
33.2
46.4
33.9
26.5
25.3
27.8
26.6
26.0
24.9
22.1
19.7
19.0
17.2
14.8
14.8
13.5
12.3
13.9
12.3
10.3
10.3
11.7
11.1
11.4
11.3
9.6
9.2
500 LFM
36.1
30.9
44.0
28.9
22.7
21.6
24.6
23.5
23.0
23.8
20.9
18.5
17.8
16.0
13.5
13.7
12.5
10.5
12.8
10.1
11.2
11.2
9.9
9.1
9.3
8.6
8.1
9.9
DS099-4 (v2.2) May 25, 2007
JA
)
750 LFM
Product Specification
35.2
30.1
42.5
27.2
21.3
20.3
22.8
21.8
21.3
23.4
20.5
18.0
17.1
15.3
12.8
13.1
11.9
10.6
10.0
12.2
10.6
9.3
8.4
8.8
8.1
7.6
9.0
8.9
JA
JB
°C/Watt
Units
) value
) value
JA
R