XC3S400-4FT256C Xilinx Inc, XC3S400-4FT256C Datasheet - Page 8

• Manufacturer Part Number: XC3S400-4FT256C
• Description: SEMI CONDUCTOR
• Manufacturer: Xilinx Inc

Specifications of XC3S400-4FT256C

• Case: BGA
• Dc: 04+

Spartan-3 FPGA Family: Introduction and Ordering Information
Ordering Information
Spartan-3 FPGAs are available in both standard and Pb-free packaging options for all device/package combinations. The
Pb-free packages include a special ‘G’ character in the ordering code.
Standard Packaging
Pb-Free Packaging
For additional information on Pb-free packaging, see
Packages".
Notes:
1. The -5 speed grade is exclusively available in the Commercial temperature range.
8
10
XC3S50
XC3S200
XC3S400
XC3S1000
XC3S1500
XC3S2000
XC3S4000
XC3S5000
Device
-4 Standard Performance
-5 High Performance
Speed Grade
Package Type
Package Type
Speed Grade
Speed Grade
Device Type
Device Type
Example:
Example:
1
XC3S50 -4 PQ 208 C
XC3S50 -4 PQ G 208 C
FG(G)1156 1156-ball Fine-Pitch Ball Grid Array (FBGA)
VQ(G)100 100-pin Very Thin Quad Flat Pack (VQFP)
PQ(G)208 208-pin Plastic Quad Flat Pack (PQFP)
CP(G)132 132-pin Chip-Scale Package (CSP)
TQ(G)144 144-pin Thin Quad Flat Pack (TQFP)
FG(G)320 320-ball Fine-Pitch Ball Grid Array (FBGA)
FG(G)456 456-ball Fine-Pitch Ball Grid Array (FBGA)
FG(G)676 676-ball Fine-Pitch Ball Grid Array (FBGA)
FG(G)900 900-ball Fine-Pitch Ball Grid Array (FBGA)
FT(G)256 256-ball Fine-Pitch Thin Ball Grid Array (FTBGA)
Package Type / Number of Pins
XAPP427
www.xilinx.com
: "Implementation and Solder Reflow Guidelines for Pb-Free
Temperature Range:
Number of Pins
Temperature Range:
Number of Pins
Pb-free
C = Commercial (T
I = Industrial (T
C = Commercial (T
I = Industrial (T
J
J
= -40
= -40
J
J
= 0
= 0
˚
˚
C to 100
C to 100
˚
˚
DS099-1_02b_071304
DS099-1_02a_071304
C to 85
C to 85
C Commercial (0°C to 85°C)
˚
˚
I Industrial (–40°C to 100°C)
˚
C)
˚
C)
C)
C)
DS099-1 (v2.2) May 25, 2007
Temperature Range (T
Product Specification
J
)
R