UPD70F3201YGC-YEU-A Renesas Electronics America, UPD70F3201YGC-YEU-A Datasheet - Page 203

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UPD70F3201YGC-YEU-A

Manufacturer Part Number
UPD70F3201YGC-YEU-A
Description
MCU 32BIT I2C 100TQFP
Manufacturer
Renesas Electronics America
Series
V850ES/Sx2r
Datasheet

Specifications of UPD70F3201YGC-YEU-A

Core Processor
RISC
Core Size
32-Bit
Speed
20MHz
Connectivity
CSI, EBI/EMI, I²C, UART/USART
Peripherals
DMA, PWM, WDT
Number Of I /o
68
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
16K x 8
Voltage - Supply (vcc/vdd)
2.2 V ~ 2.7 V
Data Converters
A/D 12x10b; D/A 2x8b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
*
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
UPD70F3201YGC-YEU-A
Manufacturer:
Renesas Electronics America
Quantity:
10 000
AD7 to AD0
CS3 to CS0
WR1, WR0
Note This idle state (TI) does not depend on the BCC register settings.
Remark
Remarks 1. TASW (address setup wait): Image of high-level width of T1 state expanded.
A23 to A0
CLKOUT
HLDRQ
HLDAK
AD15 to AD0
CS3 to CS0
Figure 5-14. Address Wait Timing (Separate Bus Read, Bus Size: 16 Bits, 16-Bit Access)
A23 to A0
2. TAHW (address hold wait): Image of low-level width of T1 state expanded.
3. The broken lines indicate high impedance.
The broken lines indicate high impedance.
CLKOUT
11
ASTB
WAIT
T1
RD
A1
10
Figure 5-13. Separate Bus Hold Timing (Bus Size: 8 Bits, Write)
T2
D1
T1
11
T1
A1
D1
CHAPTER 5 BUS CONTROL FUNCTION
A2
T2
10
T2
D2
User’s Manual U15905EJ2V1UD
Undefined
11
1111
AD15 to AD0
TI
CS3 to CS0
íç
A23 to A0
CLKOUT
ASTB
WAIT
TH
RD
TH
TASW
TH
T1
TH
A1
TAHW
Undefined
D1
1111
TI
íç
11
T2
T1
A3
10
T2
D3
11
201

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