UPD70F3201YGC-YEU-A Renesas Electronics America, UPD70F3201YGC-YEU-A Datasheet - Page 537

• Manufacturer Part Number: UPD70F3201YGC-YEU-A
• Description: MCU 32BIT I2C 100TQFP
• Manufacturer: Renesas Electronics America
• Series: V850ES/Sx2r

Specifications of UPD70F3201YGC-YEU-A

• Core Processor: RISC
• Core Size: 32-Bit
• Speed: 20MHz
• Connectivity: CSI, EBI/EMI, I²C, UART/USART
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 68
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2.2 V ~ 2.7 V
• Data Converters: A/D 12x10b; D/A 2x8b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

(3)
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Remark
(4)
Infrared reflow
Soldering Method
µ
µ
µ
µ
µ
µ
µ
PD703204F1-xxx-EA6-A
PD703204YF1-xxx-EA6-A
PD70F3204F1-EA6-A
PD703200GC-xxx-YEU-A
PD703200YGC-xxx-YEU-A
PD70F3201YGC-YEU-A
PD70F3204YF1-EA6-A
Undefined
Products with -A at the end of the part number are lead-free products.
Table 24-1. Surface Mounting Type Soldering Conditions(2/2)
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C
or higher), Count: Three times or less, Exposure limit: 3 days
that, prebake at 125°C for 20 to 72 hours)
CHAPTER 24 RECOMMENDED SOLDERING CONDITIONS
121-pin plastic FBGA (12 × 12)
121-pin plastic FBGA (12 × 12)
121-pin plastic FBGA (12 × 12)
100-pin plastic TQFP (fine pitch) (14 × 14)
100-pin plastic TQFP (fine pitch) (14 × 14)
100-pin plastic TQFP (fine pitch) (14 × 14)
121-pin plastic FBGA (12 × 12)
User’s Manual U15905EJ2V1UD
Soldering Conditions
Note
(after
IR60-203-3
Recommended Condition
Symbol
535