SAM3S4B Atmel Corporation, SAM3S4B Datasheet - Page 383
SAM3S4B
Manufacturer Part Number
SAM3S4B
Description
Manufacturer
Atmel Corporation
Specifications of SAM3S4B
Flash (kbytes)
256 Kbytes
Pin Count
64
Max. Operating Frequency
64 MHz
Cpu
Cortex-M3
# Of Touch Channels
23
Hardware Qtouch Acquisition
No
Max I/o Pins
79
Ext Interrupts
79
Usb Transceiver
1
Quadrature Decoder Channels
1
Usb Speed
Full Speed
Usb Interface
Device
Spi
3
Twi (i2c)
2
Uart
4
Ssc
1
Sd / Emmc
1
Graphic Lcd
No
Video Decoder
No
Camera Interface
No
Adc Channels
10
Adc Resolution (bits)
12
Adc Speed (ksps)
1000
Analog Comparators
1
Resistive Touch Screen
No
Dac Channels
2
Dac Resolution (bits)
12
Temp. Sensor
Yes
Crypto Engine
No
Sram (kbytes)
48
Self Program Memory
YES
Dram Memory
No
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
1.62 to 3.6
Fpu
No
Mpu / Mmu
Yes / No
Timers
3
Output Compare Channels
3
Input Capture Channels
3
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
Yes
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Figure 23-19. TDF Optimization: No TDF wait states are inserted if the TDF period is over when the next access begins
23.11.3
6500C–ATARM–8-Feb-11
NCS0
D[7:0]
NWE
MCK
NRD
TDF Optimization Disabled (TDF_MODE = 0)
read access on NCS0 (NRD controlled)
When optimization is disabled, tdf wait states are inserted at the end of the read transfer, so that
the data float period is ended when the second access begins. If the hold period of the read1
controlling signal overlaps the data float period, no additional tdf wait states will be inserted.
Figure
with no TDF optimization.
• read access followed by a read access on another chip select,
• read access followed by a write access on another chip select,
• read access followed by a write access on the same chip select,
23-20,
NRD_HOLD= 4
Figure 23-21
TDF_CYCLES = 6
and
Read to Write
Wait State
Figure 23-22
NWE_SETUP= 3
write access on NCS0 (NWE controlled)
illustrate the cases:
SAM3S
383
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