MPC8543VTANGA Freescale Semiconductor, MPC8543VTANGA Datasheet - Page 134

• Manufacturer Part Number: MPC8543VTANGA
• Description: Microprocessors - MPU PQ3 8543
• Manufacturer: Freescale Semiconductor

Specifications of MPC8543VTANGA

• Product Category: Microprocessors - MPU
• Rohs: yes
• Processor Series: PowerQUICC III
• Data Bus Width: 32 bit
• Maximum Clock Frequency: 800 MHz
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Package / Case: BGA
• I/o Voltage: 1.8 V, 2.5 V, 3.3 V
• Minimum Operating Temperature: 0 C

Thermal
21 Thermal
This section describes the thermal specifications of the device.
21.1
This section describes the thermal specifications for the HiCTE FC-CBGA package for revision 2.0
silicon.
This table shows the package thermal characteristics.
21.2
This section describes the thermal specifications for the FC-PBGA package for revision 2.1.1, 2.1.2, and
3.0 silicon.
This table shows the package thermal characteristics.
134
Die junction-to-ambient (natural convection)
Die junction-to-ambient (natural convection)
Die junction-to-ambient (200 ft/min)
Die junction-to-ambient (200 ft/min)
Die junction-to-board
Die junction-to-case
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
2. Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
3. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
4. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
Die junction-to-ambient (natural convection)
Die junction-to-ambient (natural convection)
Die junction-to-ambient (200 ft/min)
Die junction-to-ambient (200 ft/min)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
the top surface of the board near the package.
1012.1). The cold plate temperature is used for the case temperature, measured value includes the thermal resistance of the
interface layer.
Thermal for Version 2.0 Silicon HiCTE FC-CBGA with Full Lid
Thermal for Version 2.1.1, 2.1.2, and 2.1.3 Silicon FC-PBGA with
Full Lid and Version 3.1.x Silicon with Stamped Lid
Characteristic
Characteristic
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Table 84. Package Thermal Characteristics for HiCTE FC-CBGA
Table 85. Package Thermal Characteristics for FC-PBGA
Four-layer board (2s2p)
Four-layer board (2s2p)
Single-layer board (1s)
Single-layer board (1s)
Four-layer board (2s2p)
Four-layer board (2s2p)
Single-layer board (1s)
Single-layer board (1s)
JEDEC Board
JEDEC Board
N/A
N/A
Symbol
R
R
R
R
Symbol




R
R
R
R
R
R
JA
JA
JA
JA






JC
JA
JA
JA
JA
JB
Value
Value
18
13
13
0.8
9
17
12
11
8
3
Freescale Semiconductor
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Unit
Notes
Notes
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
1, 2
3
4