MPC8543VTANGA Freescale Semiconductor, MPC8543VTANGA Datasheet - Page 91

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MPC8543VTANGA

Manufacturer Part Number
MPC8543VTANGA
Description
Microprocessors - MPU PQ3 8543
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MPC8543VTANGA

Product Category
Microprocessors - MPU
Rohs
yes
Processor Series
PowerQUICC III
Data Bus Width
32 bit
Maximum Clock Frequency
800 MHz
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Package / Case
BGA
I/o Voltage
1.8 V, 2.5 V, 3.3 V
Minimum Operating Temperature
0 C
19 Package Description
This section details package parameters, pin assignments, and dimensions.
19.1
The package parameters for both the HiCTE FC-CBGA and FC-PBGA are provided in
Freescale Semiconductor
Package Parameters
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Package outline
Interconnects
Ball pitch
Ball diameter (typical)
Solder ball
Solder ball (lead-free)
Notes:
1. The HiCTE FC-CBGA package is available on only Version 2.0 of the device.
2. The FC-PBGA package is available on only versions 2.1.1 and 2.1.2, and 3.0
of the device.
Parameter
Table 70. Package Parameters
29 mm  29 mm
4.5% Ag
0.5% Cu
63% Sn
37% Pb
95% Sn
CBGA
0.6 mm
0% Ag
1 mm
783
1
29 mm  29 mm
96.5% Sn
3.5% Ag
63% Sn
37% Pb
PBGA
0.6 mm
0% Ag
1 mm
783
2
Table
Package Description
70.
91

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