MPC8543VTANGA Freescale Semiconductor, MPC8543VTANGA Datasheet - Page 3

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MPC8543VTANGA

Manufacturer Part Number
MPC8543VTANGA
Description
Microprocessors - MPU PQ3 8543
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MPC8543VTANGA

Product Category
Microprocessors - MPU
Rohs
yes
Processor Series
PowerQUICC III
Data Bus Width
32 bit
Maximum Clock Frequency
800 MHz
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Package / Case
BGA
I/o Voltage
1.8 V, 2.5 V, 3.3 V
Minimum Operating Temperature
0 C
The e500 defines features that are not implemented on this device. It also generally defines some features
that this device implements more specifically. An understanding of these differences can be critical to
ensure proper operations.
Freescale Semiconductor
— Performance monitor facility that is similar to, but separate from, the device performance
512-Kbyte L2 cache/SRAM
— Flexible configuration.
— Full ECC support on 64-bit boundary in both cache and SRAM modes
— Cache mode supports instruction caching, data caching, or both.
— External masters can force data to be allocated into the cache through programmed memory
— 1, 2, or 4 ways can be configured for stashing only.
— Eight-way set-associative cache organization (32-byte cache lines)
— Supports locking entire cache or selected lines. Individual line locks are set and cleared through
— Global locking and Flash clearing done through writes to L2 configuration registers
— Instruction and data locks can be Flash cleared separately.
— SRAM features include the following:
Address translation and mapping unit (ATMU)
— Eight local access windows define mapping within local 36-bit address space.
— Inbound and outbound ATMUs map to larger external address spaces.
DDR/DDR2 memory controller
— Programmable timing supporting DDR and DDR2 SDRAM
— 64-bit data interface
— Four banks of memory supported, each up to 4 Gbytes, to a maximum of 16 Gbytes
— DRAM chip configurations from 64 Mbits to 4 Gbits with ×8/×16 data ports
— Full ECC support
— Page mode support
monitor
ranges or special transaction types (stashing).
Book E instructions or by externally mastered transactions.
– I/O devices access SRAM regions by marking transactions as snoopable (global).
– Regions can reside at any aligned location in the memory map.
– Byte-accessible ECC is protected using read-modify-write transaction accesses for
– Three inbound windows plus a configuration window on PCI/PCI-X and PCI Express
– Four inbound windows plus a default window on RapidIO™
– Four outbound windows plus default translation for PCI/PCI-X and PCI Express
– Eight outbound windows plus default translation for RapidIO with segmentation and
– Up to 16 simultaneous open pages for DDR
smaller-than-cache-line accesses.
sub-segmentation support
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
Overview
3

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