MPC8543VTANGA Freescale Semiconductor, MPC8543VTANGA Datasheet - Page 94

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MPC8543VTANGA

Manufacturer Part Number
MPC8543VTANGA
Description
Microprocessors - MPU PQ3 8543
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MPC8543VTANGA

Product Category
Microprocessors - MPU
Rohs
yes
Processor Series
PowerQUICC III
Data Bus Width
32 bit
Maximum Clock Frequency
800 MHz
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
Package / Case
BGA
I/o Voltage
1.8 V, 2.5 V, 3.3 V
Minimum Operating Temperature
0 C
Package Description
94
Figure 56. Mechanical Dimensions and Bottom Surface Nomenclature of the FC-PBGA with Stamped Lid
Notes:
1. All d
2. Dimensioning and tolerancing per ASME Y14.5M-1994.
3. Maximum solder ball diameter measured parallel to datum A.
4. Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
5. Capacitors may not be present on all devices.
6. Caution must be taken not to short capacitors or exposed metal capacitor pads on package top.
7. Parallelism measurement shall exclude any effect of mark on top surface of package.
8. All dimensions are symmetric across the package center lines unless dimensioned otherwise.
MPC8548E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 9
imensions are in millimeters.
Freescale Semiconductor

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