LCMXO2280C-5TN144C LATTICE SEMICONDUCTOR, LCMXO2280C-5TN144C Datasheet - Page 200

• Manufacturer Part Number: LCMXO2280C-5TN144C
• Description: MACHXO PLD FLASH, SCRAM 1.8V, SMD
• Manufacturer: LATTICE SEMICONDUCTOR
• Series: MachXOr

Specifications of LCMXO2280C-5TN144C

• Cpld Type: FLASH
• No. Of Macrocells: 1140
• No. Of I/o's: 113
• Propagation Delay: 3.6ns
• Global Clock Setup Time: 1.1ns
• Frequency: 600MHz
• Supply Voltage Range: 1.71V To 3.465V
• Operating: RoHS Compliant

Lattice Semiconductor
The most common examples are 
tance Junction-to-Case (also in °C/W). Another factor is 
Knowing the reference (i.e. ambient, case or board) temperature, the power and the relevant  value, the junction
temp can be calculated as per the following equations.
Where T
P is the total power dissipation of the device.

high conductivity case mounted directly to a PCB or heatsink. And 
package is known.
Power Calculator utilizes the ambient temperature (°C) to calculate the junction temperature (°C) based on the 
for the targeted device, per equation 1 above. Users can also provide the airflow values (in LFM) to get a more
accurate value of the junction temperature.
Managing Power Consumption
One of the most critical design factors today is reducing system power consumption, especially for modern hand-
held devices and electronics. There are several design techniques that designers can use to significantly reduce
overall system power consumption. Some of these include:
Power Calculator Assumptions
The following are the assumptions made in the Power Calculator:
JA
is commonly used with natural and forced convection air-cooled systems. 
1. Reducing operating voltage.
2. Operating within the specified package temperature limitations.
3. Using optimum clock frequency reduces power consumption, as the dynamic power is directly proportional
4. Reducing the span of the design across the device. A more closely placed design utilizes fewer routing
5. Reducing the voltage swing of the I/Os where possible.
6. Using optimum encoding where possible. For example, a 16-bit binary counter has, on average, only 12%
7. Minimize the operating temperature, by the following methods:
1. The Power Calculator tool is based on equations with constants based on room temperature of 25°C.
2. The user can define the Ambient Temperature (T
T
T
T
to the frequency of operation. Designers must determine if a portion of their design can be clocked at a
lower rate which will reduce power.
resources for less power consumption.
Activity Factor and a 7-bit binary counter has an average of 28% Activity Factor. On the other hand, a 7-bit
Linear Feedback Shift Register could toggle as much as 50% Activity Factor, which causes higher power
consumption. A gray code counter, where only one bit changes at each clock edge, will use the least
amount of power, as the Activity Factor would be less than 10%.
on the power estimation. T
perature.
J
J
J
J
, T
= T
= T
= T
A
a. Use packages that can better dissipate heat. For example, packages with lower thermal impedance.
b. Place heat sinks and thermal planes around the device on the PCB.
c. Better airflow techniques using mechanical airflow guides and fans (both system fans and device
, T
A
C
B
mounted fans).
C
+ 
+ 
+ 
and T
JA
JC
JB
* P . . . . . . . . . . (1)
* P . . . . . . . . . . (3)
* P. . . . . . . . . . (2)
B
are the junction, ambient, case (or package) and board temperatures (in °C) respectively.
JA
J
is calculated from user-entered T
, Thermal Resistance Junction-to-Ambient (in °C/W) and 
11-17
A
JB
) for device Junction Temperature (T
, Thermal Resistance Junction-to-Board (in °C/W).
JB
Power Estimation and Management
A
applies when the board temp adjacent to the
and power calculation of typical room tem-
JC
is useful when the package has a
for MachXO Devices
J
) calculation based
JC
, Thermal Resis-
JA