LCMXO2280C-5TN144C LATTICE SEMICONDUCTOR, LCMXO2280C-5TN144C Datasheet - Page 224

• Manufacturer Part Number: LCMXO2280C-5TN144C
• Description: MACHXO PLD FLASH, SCRAM 1.8V, SMD
• Manufacturer: LATTICE SEMICONDUCTOR
• Series: MachXOr

Specifications of LCMXO2280C-5TN144C

• Cpld Type: FLASH
• No. Of Macrocells: 1140
• No. Of I/o's: 113
• Propagation Delay: 3.6ns
• Global Clock Setup Time: 1.1ns
• Frequency: 600MHz
• Supply Voltage Range: 1.71V To 3.465V
• Operating: RoHS Compliant

September 2010
Introduction
As Ball Grid Array (BGA) packages become increasingly popular and become more populated across the array
with higher pin count and smaller pitch, it is important to understand how they are affected by various board layout
techniques. This document provides a brief overview of PCB layout considerations when working with BGA pack-
ages. It outlines some of the most common problems and provides tips for avoiding them at the design stage. A key
challenge of adopting fine-pitch (0.8 mm or less) BGA packages is the design of a route fanout pattern that maxi-
mizes I/O utilization while minimizing fabrication cost. This technical note provides an overview of PCB design
examples provided by Lattice Semiconductor.
For more information and design examples see the PCB Design Support page at the Lattice Semiconductor web
site (www.latticesemi.com/support/pcbdesignsupport.cfm).
BGA Board Layout Recommendations
All Lattice BGA packages have Solder Mask Defined (SMD) pads. In order to evenly balance the stress in the sol-
der joints, Lattice recommends PCB solder pads be SMD with dimensions as similar to the applicable BGA as pos-
sible. If Non Solder Mask Defined Pads (NSMD) are used, the optimum pad dimensions will result in an equivalent
surface contact area on the PCB as on the BGA component.
Table 14-1. Lattice Semiconductor SMD/NSMD Pad Recommendations
© 2010 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand
or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
www.latticesemi.com
Nominal BGA
package pad
opening diameter
(mm) - SMD
PCB Solder Mask Defined (SMD) Pad Recommendations
Optimum solder
mask opening
PCB Non Solder Mask Defined (NSMD) Pad Recommendations
Optimum solder
land diameter
1. These Lattice-recommended PCB design values will result in optimum Board Level Reliability (BLR) performance for each corresponding
2. ispMACH 4000, MachXO, LatticeXP2.
3. LatticeECP3.
package. Those who use PCB design values which deviate from these recommendations should understand that the BLR performance may
be reduced.
Ball Pitch
0.4 mm
64, 132
ucBGA
0.20
0.22
0.17
Ball Pitch
100, 132,
0.5 mm
csBGA
56, 64,
0.27
0.30
0.25
144
Ball Pitch
49, 100,
0.8 mm
caBGA
0.40
0.40
0.35
256
PCB Layout Recommendations
100 fpBGA,
(Option 1
256 ftBGA
14-1
0.40
0.40
0.35
2
)
256, 388, 416, 484, 516,
256 ftBGA (Option 2
324 ftBGA, 144, 208,
672, 676, 900, 1152,
1156 fpBGA
Ball Pitch
1.0 mm
0.45
0.45
0.40
for BGA Packages
1
3
),
1704 Organic
1020, 1152,
Technical Note TN1074
fcBGA
0.50
0.50
0.45
tn1074_01.9
352 SBGA
Ball Pitch
256, 320,
1.27 mm
272, 388
PBGA,
0.60
0.60
0.55