MMC2107CFCPV33 Freescale Semiconductor, MMC2107CFCPV33 Datasheet - Page 587

• Manufacturer Part Number: MMC2107CFCPV33
• Description: IC MCU 33MHZ 128K FLASH 144-LQFP
• Manufacturer: Freescale Semiconductor
• Series: MCorer

Specifications of MMC2107CFCPV33

• Core Processor: M210
• Core Size: 32-Bit
• Speed: 33MHz
• Connectivity: EBI/EMI, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 72
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Data Bus Width: 32 bit
• Data Ram Size: 8 KB
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 33 MHz
• Number Of Programmable I/os: 32
• Number Of Timers: 4 bit
• Operating Supply Voltage: 0 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: No RoHS Version Available

22.4 Thermal Characteristics
22.5 Power Dissipation
22.6 Electrostatic Discharge (ESD) Protection
MMC2107 – Rev. 2.0
MOTOROLA
The average chip-junction temperature (T
where:
For most applications, P
P
Solving equations 1 and 2 for K gives:
where K is a constant pertaining to the particular part. K can be determined from equation (3)
by measuring P
T
J
D
can be obtained by solving equations (1) and (2) iteratively for any value of T
T
P
P
P
and T
JA
A
D
INT
I/O
= Ambient temperature, C
= Package thermal resistance, junction-to-ambient, C/W
= P
= I
= Power dissipation on input and output pins — user determined
J
(if P
DD
INT
I/O
D
V
(at equilibrium) for a known T
is neglected) is:
P
DD
I/O
, watts — chip internal power
ESD target for human body model
ESD target for machine model
HBM circuit description
MM circuit description
Thermal Resistance
I/O
1. All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for
K = P
Plastic 100-pin LQFP surface mount
Plastic 144-pin LQFP surface mount
Freescale Semiconductor, Inc.
Automotive Grade Integrated Circuits.
For More Information On This Product,
P
D
INT
P
D
T
and can be neglected. An approximate relationship between
(T
J
= K
Go to: www.freescale.com
Table 22-3. ESD Protection Characteristics
= T
A
Electrical Specifications
+ 273 C) +
Parameter
A
Table 22-2. Thermal Characteristics
Parameter
(T
+ P
J
) in C can be obtained from:
J
+ 273 C)
D
x
A
(1)
. Using this value of K, the values of P
JA
JA
P
D
2
Symbol
Symbol
R
R
HBM
MM
Series
Series
C
C
JA
Thermal Characteristics
Electrical Specifications
Value
Value
2000
1500
200
100
200
43.5
46.1
A
0
.
Technical Data
D
Units
Unit
(1)
(2)
(3)
and
C/W
pF
pF
W
W
V
V
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