AD6636CBCZ Analog Devices Inc, AD6636CBCZ Datasheet - Page 10

• Manufacturer Part Number: AD6636CBCZ
• Description: IC DIGITAL DWNCONV 4CH 256CSPBGA
• Manufacturer: Analog Devices Inc
• Series: AD6636r

Specifications of AD6636CBCZ

• Rf Type: Cellular, CDMA2000, EDGE, GPRS, GSM
• Number Of Mixers: 1
• Secondary Attributes: Down Converter
• Current - Supply: 450mA
• Voltage - Supply: 3 V ~ 3.6 V
• Package / Case: 256-CSPBGA
• Brief Features: 4/6 Independent Wideband Processing Channel, Quadrature Correction & DC Correction For Complex Input
• Supply Voltage Range: 1.7V To 1.9V
• Operating Temperature Range: -40°C To +85°C
• Ic Function: Digital Down Converter (DDC)
• Rohs Compliant: Yes
• Pin Count: 256
• Screening Level: Industrial
• Package Type: CSPBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Frequency: -
• Gain: -
• Noise Figure: -
• Lead Free Status / Rohs Status: Compliant

AD6636
ABSOLUTE MAXIMUM RATINGS
Table 7.
Parameter
ELECTRICAL
ENVIRONMENTAL
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
VDDCORE Supply Voltage
VDDIO Supply Voltage
Input Voltage
Output Voltage
Load Capacitance
Operating Temperature
Maximum Junction
Storage Temperature
(Core Supply)
(Ring or IO Supply)
Range (Ambient)
Temperature Under Bias
Range (Ambient)
Rating
2.2 V
4.0 V
−0.3 to +3.6 V (Not 5 V Tolerant)
−0.3 to VDDIO + 0.3 V
200 pF
−40°C to +85°C
125°C
−65°C to +150°C
Rev. A | Page 10 of 80
Stresses above those listed under the Absolute Maximum
Ratings may cause permanent damage to the device. This is a
stress rating only; functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
256-ball CSP_BGA package:
Thermal measurements made in the horizontal position on a
4-layer board with vias.
θ
θ
θ
θ
JA
JA
JA
JA
= 25.4°C /W, no airflow
= 23.3°C /W, 0.5 m/s airflow
= 22.6°C /W, 1.0 m/s airflow
= 21.9°C /W, 2.0 m/s airflow