cs5535 National Semiconductor Corporation, cs5535 Datasheet - Page 553

• Manufacturer Part Number: cs5535
• Description: Geode Cs5535 Companion Multi-function South Bridge
• Manufacturer: National Semiconductor Corporation

Revision 0.8
7.0
Geode™ C5535 I/O companion is packaged in a 208-terminal PBGA (plastic ball grid array). Figure 7-1 provides the
mechanical dimensions of the package.
NOTES: UNLESS OTHERWISE SPECIFIED.
1)
2)
3)
4)
SOLDER BALL COMPOSITION: SN 63%, PB 37%.
DIMENSION IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM N.
THE MOLD SURFACE AREA MAY INCLUDE DIMPLE FOR A1 BALL CORNER IDENTIFICATION.
REFERENCE JEDEC REGISTRATION MO-151, VARIATION BAJ-2.
Package Specifications
Figure 7-1. 208-Terminal PBGA Package (Body Size: 23x23x2.13 mm; Pitch: 1.27 mm)
553
www.national.com