MPC564CZP40 Freescale Semiconductor, MPC564CZP40 Datasheet - Page 1045

IC MPU 32BIT W/CODE COMP 388PBGA

MPC564CZP40

Manufacturer Part Number
MPC564CZP40
Description
IC MPU 32BIT W/CODE COMP 388PBGA
Manufacturer
Freescale Semiconductor
Series
MPC5xxr
Datasheets

Specifications of MPC564CZP40

Core Processor
PowerPC
Core Size
32-Bit
Speed
40MHz
Connectivity
CAN, EBI/EMI, SCI, SPI, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
56
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 2.7 V
Data Converters
A/D 32x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
388-BGA
Processor Series
MPC5xx
Core
PowerPC
Data Bus Width
32 bit
Data Ram Size
32 KB
Interface Type
CAN, JTAG, QSPI, SCI, SPI, UART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
56
Number Of Timers
2
Operating Supply Voltage
0 V to 5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
2 (10 bit, 32 Channel)
For Use With
MPC564EVB - KIT EVAL FOR MPC561/562/563/564
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Lead Free Status / Rohs Status
No

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MPC564CZP40
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
RCPU development access can be achieved either via the READI signals or the BDM signals on the MCU.
The access method is determined during READI module configuration.
and BDM signals are multiplexed for RCPU development access.
When the READI module is configured for RCPU development access, IEEE-ISTO 5001 compliant
vendor-defined messages are used for transmission of data in and out of the MCU.
24.14.1 RCPU Development Access Messaging
The following RCPU development access messages are used for handshaking between the device and the
tool — DSDI data message, DSDO data message, and BDM status message.
24.14.1.1 DSDI Message
The DSDI message is used by the tool to download information to the RCPU.
Freescale Semiconductor
USIU
Figure 24-78. RCPU Development Access Multiplexing between READI and BDM Signals
Development
Access
RCPU
On the MPC561/MPC563 the BDM signals are shared with the READI
signals. Therefore BDM access is limited to access via the Nexus
vendor-defined development support messages.
Multiplexer
Debug
MPC561/MPC563 Reference Manual, Rev. 1.2
READI
JTAG
NOTE
.
.
. .
.
.
TCK / DSCK / MCKI
TDO / DSDO / MDO0
TDI / DSDI / MDI0
Figure 24-78
shows how READI
BDM
signals
READI Module
24-77

Related parts for MPC564CZP40