EP2SGX90EF1152C4N Altera, EP2SGX90EF1152C4N Datasheet - Page 168

IC STRATIX II GX 90K 1152-FBGA

EP2SGX90EF1152C4N

Manufacturer Part Number
EP2SGX90EF1152C4N
Description
IC STRATIX II GX 90K 1152-FBGA
Manufacturer
Altera
Series
Stratix® II GXr
Datasheet

Specifications of EP2SGX90EF1152C4N

Number Of Logic Elements/cells
90960
Number Of Labs/clbs
4548
Total Ram Bits
4520448
Number Of I /o
558
Voltage - Supply
1.15 V ~ 1.25 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 70°C
Package / Case
1152-FBGA
Family Name
Stratix II GX
Number Of Logic Blocks/elements
90960
# I/os (max)
558
Frequency (max)
732.1MHz
Process Technology
SRAM
Operating Supply Voltage (typ)
1.2V
Logic Cells
90960
Ram Bits
4520448
Operating Supply Voltage (min)
1.15V
Operating Supply Voltage (max)
1.25V
Operating Temp Range
0C to 85C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
1152
Package Type
FC-FBGA
For Use With
544-1725 - PCIE KIT W/S II GX EP2SGX90N544-1724 - SI KIT W/SII GX EP2SGX90N544-1702 - VIDEO KIT W/SII GX EP2SGX90N
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
Lead Free Status / Rohs Status
Compliant
Other names
544-1767
EP2SGX90EF35C4NES

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0
Automated Single Event Upset (SEU) Detection
Automated
Single Event
Upset (SEU)
Detection
3–12
Stratix II GX Device Handbook, Volume 1
f
The temperature sensing diode is a very sensitive circuit which can be
influenced by noise coupled from other traces on the board, and possibly
within the device package itself, depending on device usage. The
interfacing device registers temperature based on millivolts of difference
as seen at the TSD. Switching I/O near the TSD pins can affect the
temperature reading. Altera recommends you take temperature readings
during periods of no activity in the device (for example, standby mode
where no clocks are toggling in the device), such as when the nearby I/Os
are at a DC state, and disable clock networks in the device.
Stratix II GX devices offer on-chip circuitry for automated checking of
single event upset (SEU) detection. Some applications that require the
device to operate error free at high elevations or in close proximity to
Earth’s North or South Pole will require periodic checks to ensure
continued data integrity. The error detection cyclic redundancy check
(CRC) feature controlled by the Device & Pin Options dialog box in the
Quartus II software uses a 32-bit CRC circuit to ensure data reliability and
is one of the best options for mitigating SEU.
You can implement the error detection CRC feature with existing circuitry
in Stratix II GX devices, eliminating the need for external logic.
Stratix II GX devices compute CRC during configuration and checks the
computed-CRC against an automatically computed CRC during normal
operation. The CRC_ERROR pin reports a soft error when configuration
SRAM data is corrupted, triggering device reconfiguration.
Custom-Built Circuitry
Dedicated circuitry is built into Stratix II GX devices to automatically
perform error detection. This circuitry constantly checks for errors in the
configuration SRAM cells while the device is in user mode. You can
monitor one external pin for the error and use it to trigger a
reconfiguration cycle. You can select the desired time between checks by
adjusting a built-in clock divider.
Software Interface
Beginning with version 4.1 of the Quartus II software, you can turn on the
automated error detection CRC feature in the Device & Pin Options
dialog box. This dialog box allows you to enable the feature and set the
internal frequency of the CRC between 400 kHz to 50 MHz. This controls
the rate that the CRC circuitry verifies the internal configuration SRAM
bits in the Stratix II GX FPGA.
For more information on CRC, refer to
in Altera FPGA
Devices.
AN 357: Error Detection Using CRC
Altera Corporation
October 2007

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