HD64F2239TF20I Renesas Electronics America, HD64F2239TF20I Datasheet - Page 59
HD64F2239TF20I
Manufacturer Part Number
HD64F2239TF20I
Description
MCU 3V 384K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet
1.DF2238RFA6V.pdf
(1048 pages)
Specifications of HD64F2239TF20I
Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
72
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HD64F2239TF20I
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Table 22.2
Table 22.3
Table 22.4
Table 22.5
Section 23 Clock Pulse Generator
Table 23.1
Table 23.2
Table 23.3
Table 23.3
Table 23.3
Table 23.3
Table 23.3
Table 23.4
Table 23.4
Table 23.4
Table 23.4
Table 23.4
Section 24 Power-Down Modes
Table 24.1
Table 24.2
Table 24.3
Table 24.4
Section 27 Electrical Characteristics
Table 27.1
Table 27.2
Table 27.2
Table 27.2
Table 27.3
Table 27.4
Table 27.5
Table 27.6
Table 27.7
Socket Adapters......................................................................................................758
Mode Selection in PROM Mode ............................................................................759
DC Characteristics in PROM Mode .......................................................................761
AC Characteristics in PROM Mode .......................................................................762
Damping Resistance Value.....................................................................................771
Crystal Resonator Characteristics...........................................................................771
External Clock Input Conditions (1) (H8S/2258 Group)........................................772
External Clock Input Conditions (2) (H8S/2238B, H8S/2236B) ...........................773
External Clock Input Conditions (3) (H8S/2238R, H8S/2236R) ...........................773
External Clock Input Conditions (4) (H8S/2237 Group, H8S/2227 Group) ..........774
External Clock Input Conditions (5) (H8S/2239 Group)........................................774
External Clock Input Conditions (Duty Adjustment Circuit Unused) (1)
(H8S/2258 Group)..................................................................................................775
External Clock Input Conditions (Duty Adjustment Circuit Unused) (2)
(H8S/2238B, H8S/2236B)......................................................................................775
External Clock Input Conditions (Duty Adjustment Circuit Unused) (3)
(H8S/2238R, H8S/2236R)......................................................................................776
External Clock Input Conditions (Duty Adjustment Circuit Unused) (4)
(H8S/2237 Group, H8S/2227 Group).....................................................................776
External Clock Input Conditions (Duty Adjustment Circuit Unused) (5)
(H8S/2239 Group)..................................................................................................777
LSI Internal States in Each Mode...........................................................................784
Low Power Dissipation Mode Transition Conditions ............................................786
Oscillation Settling Time Settings..........................................................................793
φ Pin States in Respective Processes ......................................................................800
Absolute Maximum Ratings...................................................................................844
DC Characteristics (1) ............................................................................................845
DC Characteristics (2) ............................................................................................847
DC Characteristics (3) ............................................................................................849
Permissible Output Current ....................................................................................851
Bus Driving Characteristics....................................................................................852
Clock Timing..........................................................................................................854
Control Signal Timing............................................................................................855
Bus Timing.............................................................................................................856
Rev. 6.00 Mar. 18, 2010 Page lvii of lx
REJ09B0054-0600
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