HD64F2239TF20I Renesas Electronics America, HD64F2239TF20I Datasheet - Page 812

MCU 3V 384K I-TEMP 100-TQFP

HD64F2239TF20I

Manufacturer Part Number
HD64F2239TF20I
Description
MCU 3V 384K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet

Specifications of HD64F2239TF20I

Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
72
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2239TF20I
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 20 Flash Memory (F-ZTAT Version)
Rev. 6.00 Mar. 18, 2010 Page 750 of 982
REJ09B0054-0600
φ
V
FWE
MD2 to MD0
RES
SWE1 bit
CC
Notes:
Period during which flash memory access is prohibited
(t
Period during which flash memory can be programmed
(Execution of program in flash memory prohibited, and data reads other than verify operations prohibited)
1.
2.
3.
4.
sswe
When entering boot mode or making a transition from boot mode to another mode, mode switching must be
carried out by means of RES input
When making a transition from boot mode to another mode, a mode programming setup time t
ns is necessary with respect to RES clearance timing.
See sections 27.2.6, 27.3.6, 27.4.6, 27.5.6 and 27.6.6, Flash Memory Characteristics.
Wait time: 100 μs.
: Wait time after setting SWE1 bit) *
(Example: Boot Mode • User Mode • User Program Mode)
t
OSC1
SWE1 set
Mode
change *
t
MDS
t
MDS
1
Figure 20.16 Mode Transition Timing
Boot
mode
2
*
4
SWE1
cleared
Mode
change *
t
RESW
min 0ms
t
MDS
*
1
2
User
mode
User program mode
*
4
*
4
User
mode
MDS
User program
mode
(min) of 200
*
4

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