HD64F2239TF20I Renesas Electronics America, HD64F2239TF20I Datasheet - Page 812

• Manufacturer Part Number: HD64F2239TF20I
• Description: MCU 3V 384K I-TEMP 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of HD64F2239TF20I

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: I²C, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 72
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 20 Flash Memory (F-ZTAT Version)
Rev. 6.00 Mar. 18, 2010 Page 750 of 982
REJ09B0054-0600
φ
V
FWE
MD2 to MD0
RES
SWE1 bit
CC
Notes:
Period during which flash memory access is prohibited
(t
Period during which flash memory can be programmed
(Execution of program in flash memory prohibited, and data reads other than verify operations prohibited)
1.
2.
3.
4.
sswe
When entering boot mode or making a transition from boot mode to another mode, mode switching must be
carried out by means of RES input
When making a transition from boot mode to another mode, a mode programming setup time t
ns is necessary with respect to RES clearance timing.
See sections 27.2.6, 27.3.6, 27.4.6, 27.5.6 and 27.6.6, Flash Memory Characteristics.
Wait time: 100 μs.
: Wait time after setting SWE1 bit) *
(Example: Boot Mode • User Mode • User Program Mode)
t
OSC1
SWE1 set
Mode
change *
t
MDS
t
MDS
1
Figure 20.16 Mode Transition Timing
Boot
mode
2
*
4
SWE1
cleared
Mode
change *
t
RESW
min 0ms
t
MDS
*
1
2
User
mode
User program mode
*
4
*
4
User
mode
MDS
User program
mode
(min) of 200
*
4