HD64F2239TF20I Renesas Electronics America, HD64F2239TF20I Datasheet - Page 940

• Manufacturer Part Number: HD64F2239TF20I
• Description: MCU 3V 384K I-TEMP 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of HD64F2239TF20I

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: I²C, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 72
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 27 Electrical Characteristics
Item
Read data
access time 2
Read data
access time 3
Read data
access time 4
Read data
access time 5
WR delay time 1 t
WR delay time 2 t
WR pulse width
1
WR pulse width
2
Write data delay
time
Write data setup
time
Write data hold
time
WAIT setup time t
WAIT hold time
BREQ
setup time
BACK delay time t
Bus-floating time t
Rev. 6.00 Mar. 18, 2010 Page 878 of 982
REJ09B0054-0600
Symbol
t
t
t
t
t
t
t
t
t
t
t
ACC2
ACC3
ACC4
ACC5
WRD1
WRD2
WSW1
WSW2
WDD
WDS
WDH
WTS
WTH
BRQS
BACD
BZD
Min
⎯
⎯
⎯
⎯
⎯
⎯
1.0 × t
− 20
1.5 × t
− 20
⎯
0.5 × t
− 57
0.5 × t
− 27
40
10
40
⎯
⎯
Condition A
cyc
cyc
cyc
cyc
Max
1.5 × t
− 50
2.0 × t
− 55
2.5 × t
− 50
3.0 × t
− 55
40
40
⎯
⎯
60
⎯
⎯
⎯
⎯
⎯
40
60
cyc
cyc
cyc
cyc
Min
⎯
⎯
⎯
⎯
⎯
⎯
1.0 × t
− 60
1.5 × t
− 60
⎯
0.5 × t
− 80
0.5 × t
− 60
90
10
90
⎯
⎯
Condition B
cyc
cyc
cyc
cyc
Max
1.5 × t
− 90
2.0 × t
− 90
2.5 × t
− 90
3.0 × t
− 90
90
90
⎯
⎯
100
⎯
⎯
⎯
⎯
⎯
90
160
cyc
cyc
cyc
cyc
Min
⎯
⎯
⎯
⎯
⎯
⎯
1.0 × t
− 20
1.5 × t
− 20
⎯
0.5 × t
− 65
0.5 × t
− 20
25
10
25
⎯
⎯
Condition C
cyc
cyc
cyc
cyc
Max
1.5 × t
− 40
2.0 × t
− 50
2.5 × t
− 40
3.0 × t
− 50
25
25
⎯
⎯
40
⎯
⎯
⎯
⎯
⎯
40
50
cyc
cyc
cyc
cyc
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Test
Conditions
Figures
27.14 to
27.18
Figure
27.16
Figure
27.19