HD64F2239TF20I Renesas Electronics America, HD64F2239TF20I Datasheet - Page 867
HD64F2239TF20I
Manufacturer Part Number
HD64F2239TF20I
Description
MCU 3V 384K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet
1.DF2238RFA6V.pdf
(1048 pages)
Specifications of HD64F2239TF20I
Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
72
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HD64F2239TF20I
Manufacturer:
Renesas Electronics America
Quantity:
10 000
- Current page: 867 of 1048
- Download datasheet (6Mb)
Section 25 Power Supply Circuit
25.4
Note on Bypass Capacitor
A laminated ceramic capacitor of 0.01 μF to 0.1 μF should be inserted as a bypass capacitor in
each pair of V
and V
.
SS
CC
The bypass capacitor should be placed as close as possible to the power supply pin of this LSI.
The capacitance value and frequency characteristics should be used according to the operating
frequency of this LSI.
Rev. 6.00 Mar. 18, 2010 Page 805 of 982
REJ09B0054-0600
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