HD64F2239TF20I Renesas Electronics America, HD64F2239TF20I Datasheet - Page 60

MCU 3V 384K I-TEMP 100-TQFP

HD64F2239TF20I

Manufacturer Part Number
HD64F2239TF20I
Description
MCU 3V 384K I-TEMP 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet

Specifications of HD64F2239TF20I

Core Processor
H8S/2000
Core Size
16-Bit
Speed
20MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
72
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2239TF20I
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Table 27.8
Table 27.9
Table 27.10 A/D Conversion Characteristics ............................................................................. 860
Table 27.11 D/A Conversion Characteristics ............................................................................. 861
Table 27.12 Flash Memory Characteristics................................................................................ 862
Table 27.13 Absolute Maximum Ratings................................................................................... 864
Table 27.14 DC Characteristics (1) ............................................................................................ 865
Table 27.14 DC Characteristics (2) ............................................................................................ 867
Table 27.14 DC Characteristics (3) ............................................................................................ 869
Table 27.15 Permissible Output Currents .................................................................................. 871
Table 27.16 Bus Driving Characteristics.................................................................................... 872
Table 27.17 Clock Timing ......................................................................................................... 874
Table 27.18 Control Signal Timing............................................................................................ 876
Table 27.19 Bus Timing............................................................................................................. 877
Table 27.20 DMAC Timing ....................................................................................................... 879
Table 27.21 Timing of On-Chip Peripheral Modules................................................................. 880
Table 27.22 I
Table 27.23 A/D Conversion Characteristics ............................................................................. 883
Table 27.24 D/A Conversion Characteristics ............................................................................. 884
Table 27.25 Flash Memory Characteristics................................................................................ 885
Table 27.26 Absolute Maximum Ratings................................................................................... 887
Table 27.27 DC Characteristics (1) ............................................................................................ 888
Table 27.27 DC Characteristics (2) ............................................................................................ 890
Table 27.27 DC Characteristics (3) ............................................................................................ 892
Table 27.28 Permissible Output Currents .................................................................................. 894
Table 27.29 Bus Drive Characteristics....................................................................................... 895
Table 27.30 Clock Timing ......................................................................................................... 897
Table 27.31 Control Signal Timing............................................................................................ 898
Table 27.32 Bus Timing............................................................................................................. 899
Table 27.33 Timing of On-Chip Peripheral Modules................................................................. 901
Table 27.34 I
Table 27.35 A/D Conversion Characteristics (F-ZTAT and Masked ROM Versions) .............. 904
Table 27.36 D/A Conversion Characteristics (F-ZTAT and Masked ROM Versions) .............. 904
Table 27.37 Flash Memory Characteristics................................................................................ 905
Table 27.38 Absolute Maximum Ratings................................................................................... 907
Table 27.39 DC Characteristics (1) ............................................................................................ 908
Table 27.39 DC Characteristics (2) ............................................................................................ 910
Table 27.39 DC Characteristics (3) ............................................................................................ 912
Table 27.40 Permissible Output Currents .................................................................................. 914
Table 27.41 Bus Driving Characteristics.................................................................................... 915
Rev. 6.00 Mar. 18, 2010 Page lviii of lx
REJ09B0054-0600
Timing of On-Chip Peripheral Modules................................................................. 857
I
2
2
2
C Bus Timing....................................................................................................... 858
C Bus Timing....................................................................................................... 882
C Bus Timing....................................................................................................... 903

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