HD64F2239TF20I Renesas Electronics America, HD64F2239TF20I Datasheet - Page 60

• Manufacturer Part Number: HD64F2239TF20I
• Description: MCU 3V 384K I-TEMP 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of HD64F2239TF20I

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: I²C, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 72
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Table 27.8
Table 27.9
Table 27.10 A/D Conversion Characteristics ............................................................................. 860
Table 27.11 D/A Conversion Characteristics ............................................................................. 861
Table 27.12 Flash Memory Characteristics................................................................................ 862
Table 27.13 Absolute Maximum Ratings................................................................................... 864
Table 27.14 DC Characteristics (1) ............................................................................................ 865
Table 27.14 DC Characteristics (2) ............................................................................................ 867
Table 27.14 DC Characteristics (3) ............................................................................................ 869
Table 27.15 Permissible Output Currents .................................................................................. 871
Table 27.16 Bus Driving Characteristics.................................................................................... 872
Table 27.17 Clock Timing ......................................................................................................... 874
Table 27.18 Control Signal Timing............................................................................................ 876
Table 27.19 Bus Timing............................................................................................................. 877
Table 27.20 DMAC Timing ....................................................................................................... 879
Table 27.21 Timing of On-Chip Peripheral Modules................................................................. 880
Table 27.22 I
Table 27.23 A/D Conversion Characteristics ............................................................................. 883
Table 27.24 D/A Conversion Characteristics ............................................................................. 884
Table 27.25 Flash Memory Characteristics................................................................................ 885
Table 27.26 Absolute Maximum Ratings................................................................................... 887
Table 27.27 DC Characteristics (1) ............................................................................................ 888
Table 27.27 DC Characteristics (2) ............................................................................................ 890
Table 27.27 DC Characteristics (3) ............................................................................................ 892
Table 27.28 Permissible Output Currents .................................................................................. 894
Table 27.29 Bus Drive Characteristics....................................................................................... 895
Table 27.30 Clock Timing ......................................................................................................... 897
Table 27.31 Control Signal Timing............................................................................................ 898
Table 27.32 Bus Timing............................................................................................................. 899
Table 27.33 Timing of On-Chip Peripheral Modules................................................................. 901
Table 27.34 I
Table 27.35 A/D Conversion Characteristics (F-ZTAT and Masked ROM Versions) .............. 904
Table 27.36 D/A Conversion Characteristics (F-ZTAT and Masked ROM Versions) .............. 904
Table 27.37 Flash Memory Characteristics................................................................................ 905
Table 27.38 Absolute Maximum Ratings................................................................................... 907
Table 27.39 DC Characteristics (1) ............................................................................................ 908
Table 27.39 DC Characteristics (2) ............................................................................................ 910
Table 27.39 DC Characteristics (3) ............................................................................................ 912
Table 27.40 Permissible Output Currents .................................................................................. 914
Table 27.41 Bus Driving Characteristics.................................................................................... 915
Rev. 6.00 Mar. 18, 2010 Page lviii of lx
REJ09B0054-0600
Timing of On-Chip Peripheral Modules................................................................. 857
I
2
2
2
C Bus Timing....................................................................................................... 858
C Bus Timing....................................................................................................... 882
C Bus Timing....................................................................................................... 903