SW00ENB-ZCC Toshiba, SW00ENB-ZCC Datasheet - Page 23

• Manufacturer Part Number: SW00ENB-ZCC
• Description: MCU, MPU & DSP Development Tools CASEWORKS
• Manufacturer: Toshiba

Specifications of SW00ENB-ZCC

• Tool Type: Development Software Support
• Core Architecture: 870
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

3.2
3.2.1
3.2.2
Moisture-proof packing should be handled with care. The handling
procedure specified for each packing type should be followed scrupulously.
If the proper procedures are not followed, the quality and reliability of
devices may be degraded. This section describes general precautions for
handling moisture-proof packing. Since the details may differ from device
to device, refer also to the relevant individual datasheets or databook.
(1) General precautions
Storage
Avoid storage locations where devices will be exposed to moisture or direct sunlight.
Follow the instructions printed on the device cartons regarding
transportation and storage.
The storage area temperature should be kept within a
temperature range of 5°C to 35°C, and relative humidity
should be maintained at between 45% and 75%.
Do not store devices in the presence of harmful (especially
corrosive) gases, or in dusty conditions.
Use storage areas where there is minimal temperature fluctuation. Rapid temperature changes
can cause moisture to form on stored devices, resulting in lead oxidation or corrosion. As a
result, the solderability of the leads will be degraded.
When repacking devices, use anti-static containers.
Do not allow external forces or loads to be applied to devices while they are in storage.
If devices have been stored for more than two years, their electrical characteristics should be
tested and their leads should be tested for ease of soldering before they are used.
Do not drop or toss device packing. The laminated aluminum material in it can be rendered
ineffective by rough handling.
The storage area temperature should be kept within a temperature range of 5°C to 30°C, and
relative humidity should be maintained at 90% (max). Use devices within 12 months of the
date marked on the package seal.
General storage
Moisture-proof packing
Follow the instructions printed on the device cartons regarding transportation and storage.
3 General Safety Precautions and Usage Considerations
9
Humidity:
@ @
Temperature: