SW00ENB-ZCC Toshiba, SW00ENB-ZCC Datasheet - Page 29

• Manufacturer Part Number: SW00ENB-ZCC
• Description: MCU, MPU & DSP Development Tools CASEWORKS
• Manufacturer: Toshiba

Specifications of SW00ENB-ZCC

• Tool Type: Development Software Support
• Core Architecture: 870
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

3.3.13
3.3.14
3.3.15
3.4
3.4.1
prevention of electromagnetic interference, which can facilitate taking corrective measures once
the design has been completed. These include installing shields and noise filters, and increasing
the thickness of the power supply wiring patterns on the printed circuit board. One effective
method, for example, is to devise several shielding options during design, and then select the
most suitable shielding method based on the results of measurements taken after the prototype
has been completed.
In most cases semiconductor devices are used with peripheral circuits and components. The input
and output signal voltages and currents in these circuits must be chosen to match the
semiconductor device’s specifications. The following factors must be taken into account.
(1) Inappropriate voltages or currents applied to a device’s input pins may cause it to operate
(2) The output pins on a device have a predetermined external circuit drive capability. If this
Each country has safety standards which must be observed. These safety standards include
requirements for quality assurance systems and design of device insulation. Such requirements
must be fully taken into account to ensure that your design conforms to the applicable safety
standards.
(1) When designing a system, be sure to incorporate fail-safe and other appropriate measures
(2) If a plastic-package device is placed in a strong electric field, surface leakage may occur due
(3) With some microcomputers and MOS memory devices, caution is required when powering on
(4) Ensure that no conductive material or object (such as a metal pin) can drop onto and short
Inspection, Testing and Evaluation
Peripheral circuits
erratically. Some devices contain pull-up or pull-down resistors. When designing your
system, remember to take the effect of this on the voltage and current levels into account.
drive capability is greater than that required, either incorporate a compensating circuit into
your design or carefully select suitable components for use in external circuits.
Safety standards
Other precautions
according to the intended purpose of your system. Also, be sure to debug your system under
actual board-mounted conditions.
to the charge-up phenomenon, resulting in device malfunction. In such cases take
appropriate measures to prevent this problem, for example by protecting the package surface
with a conductive shield.
or resetting the device. To ensure that your design does not violate device specifications,
consult the relevant databook for each constituent device.
the leads of a device mounted on a printed circuit board.
Grounding
Ground all measuring instruments, jigs, tools and soldering irons to earth.
Electrical leakage may cause a device to break down or may result in electric
shock.
3 General Safety Precautions and Usage Considerations
15