UPD78F9418AGK-9EU Renesas Electronics America, UPD78F9418AGK-9EU Datasheet - Page 300

• Manufacturer Part Number: UPD78F9418AGK-9EU
• Manufacturer: Renesas Electronics America

Specifications of UPD78F9418AGK-9EU

• Lead Free Status / Rohs Status: Supplier Unconfirmed

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recommended conditions.
representative.
The
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Caution Do not use different soldering methods together (except for partial heating).
PD789405AGC-
PD789406AGC-
PD789407AGC-
PD789415AGC-
PD789416AGC-
PD789417AGC-
PD78F9418AGC-8BT:
Infrared reflow
VPS
Wave soldering
Partial heating
Soldering Method
PD789407A and
CHAPTER 24 RECOMMENDED SOLDERING CONDITIONS
-8BT: 80-pin plastic QFP (14
-8BT: 80-pin plastic QFP (14
-8BT: 80-pin plastic QFP (14
-8BT: 80-pin plastic QFP (14
-8BT: 80-pin plastic QFP (14
-8BT: 80-pin plastic QFP (14
Table 24-1. Surface Mounting Type Soldering Conditions (1/3)
Package peak temperature: 235 C, Time: 30 seconds max. (at 210 C
or higher), Count: Twice or less
Package peak temperature: 215 C, Time: 40 seconds max. (at 200 C
or higher), Count: Twice or less
Soldering bath temperature: 260 C max., Time: 10 seconds max.,
Count: 1, Preheating temperature: 120 C max. (package surface
temperature)
Pin temperature: 350 C max., Time: 3 seconds max. (per pin row)
80-pin plastic QFP (14
PD789417A Subseries should be soldered and mounted under the following
User’s Manual U13952EJ3V1UD
Soldering Conditions
14)
14)
14)
14)
14)
14)
14)
IR35-00-2
VP15-00-2
WS60-00-1
Recommended Condition
Symbol