UPD78F9418AGK-9EU Renesas Electronics America, UPD78F9418AGK-9EU Datasheet - Page 301

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UPD78F9418AGK-9EU

Manufacturer Part Number
UPD78F9418AGK-9EU
Description
Manufacturer
Renesas Electronics America
Datasheet

Specifications of UPD78F9418AGK-9EU

Lead Free Status / Rohs Status
Supplier Unconfirmed

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Note After opening the dry pack, store it at 25 C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
PD789405AGK-
PD789406AGK-
PD789407AGK-
PD789415AGK-
PD789416AGK-
PD789417AGK-
PD78F9418GK-9EU:
Infrared reflow
VPS
Partial heating
Soldering Method
-9EU: 80-pin plastic TQFP (fine pitch) (12
-9EU: 80-pin plastic TQFP (fine pitch) (12
-9EU: 80-pin plastic TQFP (fine pitch) (12
-9EU: 80-pin plastic TQFP (fine pitch) (12
-9EU: 80-pin plastic TQFP (fine pitch) (12
-9EU: 80-pin plastic TQFP (fine pitch) (12
Table 24-1. Surface Mounting Type Soldering Conditions (2/3)
Package peak temperature: 235 C, Time: 30 seconds max. (at 210 C
or higher), Count: Twice or less, Exposure limit: 7 days
prebake at 125 C for 10 hours)
Package peak temperature: 215 C, Time: 40 seconds max. (at 200 C
or higher), Count: Twice or less, Exposure limit: 7 days
prebake at 125 C for 10 hours)
Pin temperature: 350 C max., Time: 3 seconds max. (per pin row)
CHAPTER 24 RECOMMENDED SOLDERING CONDITIONS
80-pin plastic TQFP (fine pitch) (12
User’s Manual U13952EJ3V1UD
Soldering Conditions
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Note
Note
(after that,
(after that,
IR35-107-2
VP15-107-2
Recommended Condition
Symbol
299

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