ISP1760ET,557

Manufacturer Part NumberISP1760ET,557
ManufacturerNXP Semiconductors
ISP1760ET,557 datasheet
 


Specifications of ISP1760ET,557

Package TypeTFBGAPin Count128
Lead Free Status / RoHS StatusCompliant  
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NXP Semiconductors
15. Package outline
LQFP128: plastic low profile quad flat package; 128 leads; body 14 x 20 x 1.4 mm
y
102
103
pin 1 index
128
1
e
DIMENSIONS (mm are the original dimensions)
A
UNIT
A
A
A
1
2
3
max.
0.15
1.45
mm
1.6
0.25
0.05
1.35
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT425-1
136E28
Fig 23. Package outline SOT425-1 (LQFP128)
ISP1760_4
Product data sheet
X
65
64
39
38
w
Z D
M
b
p
D
H
D
0
scale
(1)
(1)
b
c
D
E
e
H
p
D
0.27
0.20
20.1
14.1
22.15
16.15
0.5
0.17
0.09
19.9
13.9
21.85
15.85
REFERENCES
JEDEC
JEITA
MS-026
Rev. 04 — 4 February 2008
Embedded Hi-Speed USB host controller
A
Z E
e
H
A
E
A
E
2
A
1
w
M
b
p
detail X
v
M
A
B
v
M
B
5
10 mm
H
L
L
v
w
y
Z
E
p
D
0.75
0.81
1
0.2
0.12
0.1
0.45
0.59
EUROPEAN
PROJECTION
ISP1760
SOT425-1
(A )
3
L
p
L
(1)
(1)
Z
E
o
0.81
7
o
0.59
0
ISSUE DATE
00-01-19
03-02-20
© NXP B.V. 2008. All rights reserved.
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