SAM9RL64 Atmel Corporation, SAM9RL64 Datasheet - Page 229

• Manufacturer Part Number: SAM9RL64
• Manufacturer: Atmel Corporation

Specifications of SAM9RL64

• Flash (kbytes): 0 Kbytes
• Pin Count: 217
• Max. Operating Frequency: 240 MHz
• Cpu: ARM926
• Hardware Qtouch Acquisition: No
• Max I/o Pins: 118
• Ext Interrupts: 118
• Usb Transceiver: 1
• Usb Speed: Hi-Speed
• Usb Interface: Device
• Spi: 1
• Twi (i2c): 2
• Uart: 5
• Ssc: 2
• Sd / Emmc: 1
• Graphic Lcd: Yes
• Video Decoder: No
• Camera Interface: No
• Adc Channels: 6
• Adc Resolution (bits): 10
• Adc Speed (ksps): 220
• Resistive Touch Screen: Yes
• Temp. Sensor: No
• Crypto Engine: No
• Sram (kbytes): 64
• Self Program Memory: NO
• External Bus Interface: 1
• Dram Memory: sdram
• Nand Interface: Yes
• Picopower: No
• Temp. Range (deg C): -40 to 85
• I/o Supply Class: 1.8/3.3
• Operating Voltage (vcc): 1.08 to 1.32
• Fpu: No
• Mpu / Mmu: No / Yes
• Timers: 3
• Output Compare Channels: 3
• Input Capture Channels: 3
• Pwm Channels: 4
• 32khz Rtc: Yes
• Calibrated Rc Oscillator: No

B.5.5
B.5.6
B.5.7
ARM DDI 0029G
CLAMP (0101)
HIGHZ (0111)
CLAMPZ (1001)
This instruction connects a 1 bit shift register, the BYPASS register, between TDI and
TDO. When the CLAMP instruction is loaded into the instruction register, the state of
all the scan cell output signals is defined by the values previously loaded into the
currently loaded scan chain. This instruction must only be used when scan chain 0 is the
currently selected scan chain:
•
•
•
This instruction connects a 1 bit shift register, the BYPASS register, between TDI and
TDO. When the HIGHZ instruction is loaded into the instruction register, the Address
bus, A[31:0], the data bus, D[31:0], nRW, nOPC, LOCK, MAS[1:0], and nTRANS
are all driven to the high impedance state and the external HIGHZ signal is driven
HIGH. This is as if the signal TBE had been driven LOW:
•
•
•
This instruction connects a 1 bit shift register, the BYPASS register, between TDI and
TDO.
When the CLAMPZ instruction is loaded into the instruction register, all the 3-state
outputs are placed in their inactive state, but the data supplied to the scan cell outputs is
derived from the scan cells. The purpose of this instruction is to ensure that, during
production test, each output can be disabled when its data value is either a logic 0 or a
logic 1:
•
•
•
In the CAPTURE-DR state, a logic 0 is captured by the bypass register.
In the SHIFT-DR state, test data is shifted into the bypass register using TDI and
out using TDO after a delay of one TCK cycle. The first bit shifted out is a zero.
In the UPDATE-DR state the bypass register is not affected.
In the CAPTURE-DR state, a logic 0 is captured by the bypass register.
In the SHIFT-DR state, test data is shifted into the bypass register using TDI and
out using TDO after a delay of one TCK cycle. The first bit shifted out is a zero.
In the UPDATE-DR state, the bypass register is not affected.
In the CAPTURE-DR state, a logic 0 is captured by the bypass register.
In the SHIFT-DR state, test data is shifted into the bypass register using TDI and
out using TDO after a delay of one TCK cycle. The first bit shifted out is a zero.
In the UPDATE-DR state, the bypass register is not affected.
Copyright © 1994-2001. All rights reserved.
Debug in Depth
B-11