ST10F276Z5T3 STMicroelectronics, ST10F276Z5T3 Datasheet - Page 170

MCU 16BIT 832KBIT FLASH 144-TQFP

ST10F276Z5T3

Manufacturer Part Number
ST10F276Z5T3
Description
MCU 16BIT 832KBIT FLASH 144-TQFP
Manufacturer
STMicroelectronics
Series
ST10r
Datasheet

Specifications of ST10F276Z5T3

Core Processor
ST10
Core Size
16-Bit
Speed
40MHz
Connectivity
ASC, CAN, EBI/EMI, I²C, SSC, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
111
Program Memory Size
832KB (832K x 8)
Program Memory Type
FLASH
Ram Size
68K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 24x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
144-TQFP, 144-VQFP
Cpu Family
ST10
Device Core Size
16b
Frequency (max)
40MHz
Interface Type
CAN/I2C
Total Internal Ram Size
68KB
# I/os (max)
111
Number Of Timers - General Purpose
5
Operating Supply Voltage (typ)
5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
4.5V
On-chip Adc
24-chx10-bit
Instruction Set Architecture
CISC/RISC
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Pin Count
144
Package Type
LQFP
Processor Series
ST10F27x
Core
ST10
Data Bus Width
16 bit
Data Ram Size
68 KB
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
111
Number Of Timers
5
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
For Use With
497-6399 - KIT DEV STARTER ST10F276Z5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant

Available stocks

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Part Number
Manufacturer
Quantity
Price
Part Number:
ST10F276Z5T3
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
ST10F276Z5T3
Manufacturer:
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Part Number:
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Register set
170/239
Table 79.
BUSCON0 (FF0Ch / 86h)
BUSCON1 (FF14h / 8Ah)
BUSCON2 (FF16h / 8Bh)
BUSCON3 (FF18h / 8Ch)
CSWEN0 CSREN0 RDYPOL0 RDYEN0
CSWEN1 CSREN1 RDYPOL1 RDYEN1
CSWEN2 CSREN2 RDYPOL2 RDYEN2
CSWEN3 CSREN3 RDYPOL3 RDYEN3
WRCFG
CLKEN
BYTDIS
ROMEN
SGTDIS
ROMS1
STKSZ
RW
RW
RW
RW
15
15
15
15
Bit
RW
RW
RW
RW
14
14
14
14
SYSCON description (continued)
RW
13
13
13
13
Write configuration control (inverted copy of WRC bit of RP0H)
‘0’: Pins WR and BHE retain their normal function.
‘1’: Pin WR acts as WRL, pin BHE acts as WRH.
System clock output enable (CLKOUT)
‘0’: CLKOUT disabled, pin may be used for general purpose I/O.
‘1’: CLKOUT enabled, pin outputs the system clock signal or a prescaled value of
system clock according to XCLKOUTDIV register setting.
Disable/enable control for pin BHE (set according to data bus width)
‘0’: Pin BHE enabled.
‘1’: Pin BHE disabled, pin may be used for general purpose I/O.
Internal memory enable (set according to pin EA during reset)
‘0’: Internal memory disabled: Accesses to the IFlash Memory area use the
external bus.
‘1’: Internal memory enabled.
Segmentation disable/enable control
‘0’: Segmentation enabled (CSP is saved/restored during interrupt entry/exit).
‘1’: Segmentation disabled (Only IP is saved/restored).
Internal memory mapping
‘0’: Internal memory area mapped to segment 0 (00’0000h...00’7FFFh).
‘1’: Internal memory area mapped to segment 1 (01’0000h...01’7FFFh).
System stack size
Selects the size of the system stack (in the internal I-RAM) from 32 to 1024 words.
RW
RW
RW
RW
12
12
12
12
11
11
11
11
-
-
-
-
BUSACT0 ALECTL0
BUSACT1 ALECTL1
BUSACT2 ALECTL2
BUSACT3 ALECTL3
RW
RW
RW
RW
10
10
10
10
RW
RW
RW
RW
9
9
9
9
SFR
SFR
SFR
SFR
Function
8
8
8
8
-
-
-
-
7
7
7
7
BTYP
BTYP
BTYP
BTYP
RW
RW
RW
RW
6
6
6
6
MTTC0 RWDC0
MTTC1 RWDC1
MTTC2 RWDC2
MTTC3 RWDC3
RW
RW
RW
RW
5
5
5
5
RW
RW
RW
RW
Reset value: 0000h
Reset value: 0000h
Reset value: 0000h
Reset value: 0xx0h
4
4
4
4
ST10F276Z5
3 2 1 0
3 2 1 0
3 2 1 0
3 2 1 0
MCTC
MCTC
MCTC
MCTC
RW
RW
RW
RW

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