ST10F276Z5T3 STMicroelectronics, ST10F276Z5T3 Datasheet - Page 179

• Manufacturer Part Number: ST10F276Z5T3
• Description: MCU 16BIT 832KBIT FLASH 144-TQFP
• Manufacturer: STMicroelectronics
• Series: ST10r

Specifications of ST10F276Z5T3

• Core Processor: ST10
• Core Size: 16-Bit
• Speed: 40MHz
• Connectivity: ASC, CAN, EBI/EMI, I²C, SSC, UART/USART
• Peripherals: POR, PWM, WDT
• Number Of I /o: 111
• Program Memory Size: 832KB (832K x 8)
• Program Memory Type: FLASH
• Ram Size: 68K x 8
• Voltage - Supply (vcc/vdd): 4.5 V ~ 5.5 V
• Data Converters: A/D 24x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 144-TQFP, 144-VQFP
• Cpu Family: ST10
• Device Core Size: 16b
• Frequency (max): 40MHz
• Interface Type: CAN/I2C
• Total Internal Ram Size: 68KB
• # I/os (max): 111
• Number Of Timers - General Purpose: 5
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 4.5V
• On-chip Adc: 24-chx10-bit
• Instruction Set Architecture: CISC/RISC
• Operating Temp Range: -40C to 125C
• Operating Temperature Classification: Automotive
• Mounting: Surface Mount
• Pin Count: 144
• Package Type: LQFP
• Processor Series: ST10F27x
• Core: ST10
• Data Bus Width: 16 bit
• Data Ram Size: 68 KB
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 111
• Number Of Timers: 5
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• For Use With: 497-6399 - KIT DEV STARTER ST10F276Z5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant

ST10F276Z5
23.3
Power considerations
The average chip-junction temperature, T
following equation:
Where:
T
Θ
P
P
P
Most often in applications, P
significant if the device is configured to continuously drive external modules and/or
memories.
An approximate relationship between P
Therefore (solving equations 1 and 2):
Where:
K is a constant for the particular part, which may be determined from equation (3) by
measuring P
are obtained by solving equations (1) and (2) iteratively for any value of T
Table 90.
Based on thermal characteristics of the package and with reference to the power
consumption figures provided in the next tables and diagrams, the following product
classification can be proposed. In any case, the exact power consumption of the device
inside the application must be computed according to different working conditions, thermal
profiles, real thermal resistance of the system (including printed circuit board or other
substrata) and I/O activity.
A
D
INT
I/O
JA
Symbol
is the Ambient Temperature in °C,
is the sum of P
is the Package Junction-to-Ambient Thermal Resistance, in °C/W,
represents the Power Dissipation on Input and Output Pins; user determined.
Θ
is the product of I
JA
D
Thermal characteristics
Thermal resistance junction-ambient
PQFP 144 - 28 x 28 x 3.4 mm / 0.65 mm pitch
LQFP 144 - 20 x 20 mm / 0.5 mm pitch
LQFP 144 - 20 x 20 mm / 0.5 mm pitch on four layer
FR4 board (2 layers signals / 2 layers power)
(at equilibrium) for a known T
INT
and P
DD
and V
K = P
I/O
I/O
< P
(P
DD
D
Description
P
D
x (T
T
, expressed in Watt. This is the Chip Internal Power,
INT
D
J
= P
= K / (T
= T
,which may be ignored. On the other hand, P
A
INT
+ 273 °C) + Θ
D
A
and T
J
+ (P
+ P
, in degrees Celsius, is calculated using the
A.
J
+ 273 °C) (2)
I/O
D
Using this value of K, the values of P
J
x Θ
),
(if P
JA
I/O
JA
) 1)
x P
is neglected) is given by:
D
2
(3)
Value (typical)
Electrical characteristics
30
40
35
A
.
I/O
D
°C/W
may be
Unit
179/239
and T
J