ST10F276Z5T3 STMicroelectronics, ST10F276Z5T3 Datasheet - Page 72

MCU 16BIT 832KBIT FLASH 144-TQFP

ST10F276Z5T3

Manufacturer Part Number
ST10F276Z5T3
Description
MCU 16BIT 832KBIT FLASH 144-TQFP
Manufacturer
STMicroelectronics
Series
ST10r
Datasheet

Specifications of ST10F276Z5T3

Core Processor
ST10
Core Size
16-Bit
Speed
40MHz
Connectivity
ASC, CAN, EBI/EMI, I²C, SSC, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
111
Program Memory Size
832KB (832K x 8)
Program Memory Type
FLASH
Ram Size
68K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 24x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
144-TQFP, 144-VQFP
Cpu Family
ST10
Device Core Size
16b
Frequency (max)
40MHz
Interface Type
CAN/I2C
Total Internal Ram Size
68KB
# I/os (max)
111
Number Of Timers - General Purpose
5
Operating Supply Voltage (typ)
5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
4.5V
On-chip Adc
24-chx10-bit
Instruction Set Architecture
CISC/RISC
Operating Temp Range
-40C to 125C
Operating Temperature Classification
Automotive
Mounting
Surface Mount
Pin Count
144
Package Type
LQFP
Processor Series
ST10F27x
Core
ST10
Data Bus Width
16 bit
Data Ram Size
68 KB
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
111
Number Of Timers
5
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
For Use With
497-6399 - KIT DEV STARTER ST10F276Z5
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Compliant

Available stocks

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Quantity
Price
Part Number:
ST10F276Z5T3
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Quantity:
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Part Number:
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Central processing unit (CPU)
6
72/239
Central processing unit (CPU)
The CPU includes a 4-stage instruction pipeline, a 16-bit arithmetic and logic unit (ALU) and
dedicated SFRs. Additional hardware has been added for a separate multiply and divide
unit, a bit-mask generator and a barrel shifter.
Most of the ST10F276Z5 instructions can be executed in one instruction cycle which
requires 31.25ns at 64 MHz CPU clock. For example, shift and rotate instructions are
processed in one instruction cycle independent of the number of bits to be shifted.
Multiple-cycle instructions have been optimized: branches are carried out in 2 cycles, 16 x
16-bit multiplication in 5 cycles and a 32/16-bit division in 10 cycles.
The jump cache reduces the execution time of repeatedly performed jumps in a loop, from
2 cycles to 1 cycle.
The CPU uses a bank of 16 word registers to run the current context. This bank of General
Purpose Registers (GPR) is physically stored within the on-chip Internal RAM (IRAM) area.
A Context Pointer (CP) register determines the base address of the active register bank to
be accessed by the CPU.
The number of register banks is only restricted by the available Internal RAM space. For
easy parameter passing, a register bank may overlap others.
A system stack of up to 2048 bytes is provided as a storage for temporary data. The system
stack is allocated in the on-chip RAM area, and it is accessed by the CPU via the stack
pointer (SP) register.
Two separate SFRs, STKOV and STKUN, are implicitly compared against the stack pointer
value upon each stack access for the detection of a stack overflow or underflow.
Figure 14. CPU Block Diagram (MAC Unit not included)
512 Kbyte
memory
Flash
32
Exec. Unit
BUSCON 0
BUSCON 1
BUSCON 2
BUSCON 3
BUSCON 4
Data Pg. Ptrs
Instr. Ptr
STKOV
STKUN
SYSCON
4-Stage
Pipeline
PSW
SP
ADDRSEL 1
ADDRSEL 2
ADDRSEL 3
ADDRSEL 4
Code Seg. Ptr.
Bit-Mask Gen.
Mul./Div.-HW
Barrel-Shift
CPU
16-Bit
MDH
MDL
ALU
CP
Registers
General
Purpose
R15
R0
16
16
ST10F276Z5
2 Kbyte
Internal
Bank
Bank
Bank
RAM
n
0
i

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