MC68HC908JK8CP Freescale Semiconductor, MC68HC908JK8CP Datasheet - Page 198

• Manufacturer Part Number: MC68HC908JK8CP
• Manufacturer: Freescale Semiconductor

Specifications of MC68HC908JK8CP

• Cpu Family: HC08
• Device Core Size: 8b
• Frequency (max): 8MHz
• Interface Type: SCI
• Program Memory Type: Flash
• Program Memory Size: 8KB
• Total Internal Ram Size: 256Byte
• # I/os (max): 15
• Number Of Timers - General Purpose: 4
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• On-chip Adc: 13-chx8-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Through Hole
• Pin Count: 20
• Package Type: PDIP
• Lead Free Status / Rohs Status: Not Compliant

Mechanical Specifications
18.7 32-Pin Low-Profile Quad Flat Pack (LQFP)
198
SEATING
PLANE
9
B
C
–AB–
–AC–
B1
E
–T–
H
MC68HC908JL8/JK8 • MC68HC08JL8/JK8 • MC68HC908KL8 Data Sheet, Rev. 3.1
8
1
8X
M
DETAIL AD
32
W
9
S1
A1
G
A
S
0.10 (0.004) AC
DETAIL Y
Figure 18-6. 32-Pin LQFP (Case #873A)
X
–Z–
25
K
R
4X
4X
17
Q
0.20 (0.008)
–U–
0.20 (0.008)
V1
DETAIL AD
V
AB
AC
T–U
SECTION AE–AE
F
É É
É É
É É
É É
T–U
METAL
BASE
Z
N
J
Z
D
P
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –AB– IS LOCATED AT BOTTOM
4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED
5. DIMENSIONS S AND V TO BE DETERMINED AT
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
7. DIMENSION D DOES NOT INCLUDE DAMBAR
8. MINIMUM SOLDER PLATE THICKNESS SHALL BE
9. EXACT SHAPE OF EACH CORNER MAY VARY
Y14.5M, 1982.
OF LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
AT DATUM PLANE –AB–.
SEATING PLANE –AC–.
PROTRUSION. ALLOWABLE PROTRUSION IS
0.250 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –AB–.
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE D DIMENSION TO EXCEED
0.520 (0.020).
0.0076 (0.0003).
FROM DEPICTION.
DIM
A1
B1
S1
V1
G
M
Q
W
A
B
C
D
E
F
H
J
K
N
P
R
S
V
X
1.400
0.300
1.350
0.300
0.050
0.090
0.500
0.090
0.150
MILLIMETERS
MIN
7.000 BSC
3.500 BSC
7.000 BSC
3.500 BSC
0.800 BSC
0.400 BSC
9.000 BSC
4.500 BSC
9.000 BSC
4.500 BSC
0.200 REF
1.000 REF
DETAIL Y
1
12 REF
1.600
0.450
1.450
0.400
0.150
0.200
0.700
0.160
0.250
MAX
Freescale Semiconductor
5
0.055
0.012
0.053
0.012
0.002
0.004
0.020
0.004
0.006
MIN
0.276 BSC
0.138 BSC
0.276 BSC
0.138 BSC
0.031 BSC
0.016 BSC
0.354 BSC
0.177 BSC
0.354 BSC
0.177 BSC
0.008 REF
0.039 REF
1
12 REF
INCHES
AE
AE
0.063
0.018
0.057
0.016
0.006
0.008
0.028
0.006
0.010
MAX
5