UPD70F3738GF-GAS-AX Renesas Electronics America, UPD70F3738GF-GAS-AX Datasheet - Page 1070

• Manufacturer Part Number: UPD70F3738GF-GAS-AX
• Description: MCU 32BIT V850ES/JX3-L 100-LQFP
• Manufacturer: Renesas Electronics America
• Series: V850ES/Jx3-Lr

Specifications of UPD70F3738GF-GAS-AX

• Core Processor: RISC
• Core Size: 32-Bit
• Speed: 20MHz
• Connectivity: CSI, EBI/EMI, I²C, UART/USART
• Peripherals: DMA, LVD, PWM, WDT
• Number Of I /o: 84
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 12x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

1068
4th
Edition
Modification of 21.1 Features
Modification of Table 21-1. Interrupt Source List
Modification of Table 21-3. Interrupt Control Registers (xxICn)
Modification of 21.3.5 Interrupt mask registers 0 to 3 (IMR0 to IMR3)
Modification of Table 23-1. Standby Modes
Modification of Figure 23-1. Status Transition
Modification of Table 23-3. Operating Status in HALT Mode
Modification of Table 23-5. Operating Status in IDLE1 Mode
Modification of Table 23-7. Operating Status in IDLE2 Mode
Modification of Table 23-8. Operating Status in STOP Mode
Modification of Table 23-9. Operating Status in Low-Voltage STOP Mode
Modification of Table 23-11. Operating Status in Subclock Operation Mode
Modification of Table 23-12. Operating Status in Low-Voltage Subclock Operation Mode
Modification of Table 23-13. Operating Status in Sub-IDLE Mode
Modification of Table 23-14. Operating Status in Low-Voltage Sub-IDLE Mode
Addition of 23.9 RTC backup Mode (
Modification of Figure 26-1. Block Diagram of Low-Voltage Detector
Modification of 26.3 Registers (2)
Addition of Figure 28-2. Regulator (
Modification of CHAPTER 29 OPTION BYTE
Modification of CHAPTER 30 FLASH MEMORY
Modification of 30.1 Features
Addition of Figure 30-1. Flash Memory Mapping (2/2)
Modification of 30.4 Rewriting by Dedicated Flash Memory Programmer
Modification of Figure 31-5. Memory Spaces Where Debug Monitor Programs Are
Allocated
Modification of 32.9 Flash Memory Programming Characteristics (1)
Addition of CHAPTER 33 ELECTRICAL SPECIFICATIONS (Target) (µPD70F3792,
70F3793)
Modification of A.4.1 When using IECUBE QB-V850ESSX2, QB-V850ESJX3L
Modification of A.7 Flash Memory Writing Tools
Modification of APPENDIX B MAJOR DIFFERENCES BETWEEN PRODUCTS
APPENDIX E REVISION HISTORY
μ
μ
PD70F3792, 70F3793)
PD70F3792, 70F3793 only)
User’s Manual U18953EJ5V0UD
Description
CHAPTER 21
INTERRUPT
SERVICING/EXCEPTI
ON PROCESSING
FUNCTION
CHAPTER 23
STANDBY FUNCTION
CHAPTER 26
LOW-VOLTAGE
DETECTOR (LVI)
CHAPTER 28
REGULATOR
CHAPTER 29 OPTION
BYTE
CHAPTER 30 FLASH
MEMORY
CHAPTER 31 ON-
CHIP DEBUG
FUNCTION
CHAPTER 32
ELECTRICAL
SPECIFICATIONS
CHAPTER 33
ELECTRICAL
SPECIFICATIONS
(Target)
APPENDIX A
DEVELOPMENT
TOOLS
APPENDIX B MAJOR
DIFFERENCES
BETWEEN
PRODUCTS
Applied to:
(6/6)