UPD70F3738GF-GAS-AX Renesas Electronics America, UPD70F3738GF-GAS-AX Datasheet - Page 939

• Manufacturer Part Number: UPD70F3738GF-GAS-AX
• Description: MCU 32BIT V850ES/JX3-L 100-LQFP
• Manufacturer: Renesas Electronics America
• Series: V850ES/Jx3-Lr

Specifications of UPD70F3738GF-GAS-AX

• Core Processor: RISC
• Core Size: 32-Bit
• Speed: 20MHz
• Connectivity: CSI, EBI/EMI, I²C, UART/USART
• Peripherals: DMA, LVD, PWM, WDT
• Number Of I /o: 84
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 12x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: *
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

31.2.3 Allocation of user resources
device and implement each debug function. These items need to be set in the user program or using the compiler
options.
The user must prepare the following resources to perform communication between MINICUBE2 and the target
(1) Allocation of memory space
(2) Security ID setting
The shaded portions in Figure 31-5 are the areas reserved for placing the debug monitor program, so user
programs and data cannot be allocated to these spaces. These spaces must be secured so as not to be used
by the user program.
The ID code must be embedded in the area between 0000070H and 0000079H in Figure 31-5, to prevent the
memory from being read by an unauthorized person. For details, see 31.3 ROM Security Function.
CHAPTER 31 ON-CHIP DEBUG FUNCTION
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