UPD70F3737GC-UEU-AX Renesas Electronics America, UPD70F3737GC-UEU-AX Datasheet - Page 777

• Manufacturer Part Number: UPD70F3737GC-UEU-AX
• Description: MCU 32BIT V850ES/JX3-L 100-LQFP
• Manufacturer: Renesas Electronics America
• Series: V850ES/Jx3-Lr

Specifications of UPD70F3737GC-UEU-AX

• Package / Case: *
• Voltage - Supply (vcc/vdd): 2.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Speed: 20MHz
• Number Of I /o: 84
• Core Processor: RISC
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Program Memory Size: 128KB (128K x 8)
• Data Converters: A/D 12x10b, D/A 2x8b
• Oscillator Type: Internal
• Peripherals: DMA, LVD, PWM, WDT
• Connectivity: CSI, EBI/EMI, I²C, UART/USART
• Core Size: 32-Bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

29.1 Debugging with DCU
chip debug emulator (MINICUBE).
29.1.1 Connection circuit example
Figure 29-1. Circuit Connection Example When Debug Interface Pins Are Used for Communication Interface
Programs can be debugged using the debug interface pins (DRST, DCK, DMS, DDI, and DDO) to connect the on-
Notes 1. Example of pin connection when MINICUBE is not connected
2. A pull-down resistor is provided on chip.
3. For flash memory rewriting
MINICUBE
RESET
FLMD0
DRST
DMS
DDO
GND
VDD
DCK
DDI
CHAPTER 29 ON-CHIP DEBUG FUNCTION
Preliminary User’s Manual U18953EJ1V0UD
Note 1
EV
DCK
DMS
DDI
DDO
DRST
RESET
FLMD0
FLMD1/PDL5
EV
V850ES/JG3-L
DD
SS
Note 2
Note 3
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