upd70f3017ay Renesas Electronics Corporation., upd70f3017ay Datasheet - Page 462

• Manufacturer Part Number: upd70f3017ay
• Description: V850/sa1tm 32-/16-bit Single-chip Microcontroller
• Manufacturer: Renesas Electronics Corporation.

representative.
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The V850/SA1 should be soldered and mounted under the following recommended conditions.
For soldering methods and conditions other than those recommended below, consult an NEC Electronics sales
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
Caution Do not use different soldering methods together (except for partial heating).
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Infrared reflow
VPS
Partial heating
Infrared reflow
VPS
Partial heating
Soldering Method
Soldering Method
µ
µ
µ
µ
µ
µ
µ
µ
PD703015BYGC-×××-8EU: 100-pin plastic LQFP (fine pitch) (14 × 14)
PD703017AYGC-×××-8EU: 100-pin plastic LQFP (fine pitch) (14 × 14)
PD70F3015BGC-8EU: 100-pin plastic LQFP (fine pitch) (14 × 14)
PD70F3015BYGC-8EU: 100-pin plastic LQFP (fine pitch) (14 × 14)
PD703014BGC-×××-8EU: 100-pin plastic LQFP (fine pitch) (14 × 14)
PD703014BYGC-×××-8EU: 100-pin plastic LQFP (fine pitch) (14 × 14)
PD703015BGC-×××-8EU: 100-pin plastic LQFP (fine pitch) (14 × 14)
PD703017AGC-×××-8EU: 100-pin plastic LQFP (fine pitch) (14 × 14)
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Two times or less
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: Two times or less
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
Package peak temperature: 235°C, Time: 30 seconds max. (at 210°C or higher),
Count: Two times or less
Exposure limit: 7 days
Package peak temperature: 215°C, Time: 40 seconds max. (at 200°C or higher),
Count: Two times or less
Exposure limit: 7 days
Pin temperature: 350°C max., Time: 3 seconds max. (per pin row)
CHAPTER 19 RECOMMENDED SOLDERING CONDITIONS
Table 19-1. Surface Mounting Type Soldering Conditions (1/4)
Note
Note
(after that, prebake at 125°C for 10 hours)
(after that, prebake at 125°C for 10 hours)
User’s Manual U12768EJ4V1UD
Soldering Conditions
Soldering Conditions
Recommended
Recommended
VP15-107-2
IR35-107-2
VP15-00-2
IR35-00-2
Condition
Condition
Symbol
Symbol
–
–