upd70f3017ay Renesas Electronics Corporation., upd70f3017ay Datasheet - Page 465

• Manufacturer Part Number: upd70f3017ay
• Description: V850/sa1tm 32-/16-bit Single-chip Microcontroller
• Manufacturer: Renesas Electronics Corporation.

(7)
Note After opening the dry pack, store it at 25°C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Remark
(8)
Infrared reflow
Soldering Method
µ
µ
µ
µ
µ
µ
µ
µ
µ
µ
µ
µ
µ
µ
Undefined
PD703014AF1-×××-EA6-A: 121-pin plastic FBGA (12 × 12)
PD703014AYF1-×××-EA6-A: 121-pin plastic FBGA (12 × 12)
PD703014BF1-×××-EA6-A: 121-pin plastic FBGA (12 × 12)
PD703015AF1-×××-EA6-A: 121-pin plastic FBGA (12 × 12)
PD703015AYF1-×××-EA6-A: 121-pin plastic FBGA (12 × 12)
PD703015BF1-×××-EA6-A: 121-pin plastic FBGA (12 × 12)
PD703017AF1-×××-EA6-A: 121-pin plastic FBGA (12 × 12)
PD703017AYF1-×××-EA6-A: 121-pin plastic FBGA (12 × 12)
PD70F3015BF1-EA6-A:
PD70F3017AF1-EA6-A:
PD70F3017AYF1-EA6-A:
PD703014BYF1-×××-EA6-A: 121-pin plastic FBGA (12 × 12)
PD703015BYF1-×××-EA6-A: 121-pin plastic FBGA (12 × 12)
PD70F3015BYF1-EA6-A:
Products with -A at the end of the part number are lead-free products.
Package peak temperature: 260°C, Time: 60 seconds max. (at 220°C or higher),
Count: Three times or less,
Exposure limit: 3 days
Table 19-1. Surface Mounting Type Soldering Conditions (4/4)
CHAPTER 19 RECOMMENDED SOLDERING CONDITIONS
121-pin plastic FBGA (12 × 12)
121-pin plastic FBGA (12 × 12)
121-pin plastic FBGA (12 × 12)
121-pin plastic FBGA (12 × 12)
Note
(after that, prebake at 125°C for 20 to 72 hours)
User’s Manual U12768EJ4V1UD
Soldering Conditions
IR60-203-3
Recommended
Condition
Symbol
465