HD64F2676VFC33 Renesas Electronics America, HD64F2676VFC33 Datasheet - Page 12

IC H8S MCU FLASH 256K 144-QFP

HD64F2676VFC33

Manufacturer Part Number
HD64F2676VFC33
Description
IC H8S MCU FLASH 256K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheets

Specifications of HD64F2676VFC33

Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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Rev. 3.00 Mar 17, 2006 page x of l
Item
17.4 Operation
19.12 Usage Notes
Figure 19.12 Power-
On/Off Timing
(H8S/2678Group)
Section 20 Masked
ROM
Page
769
804
810
Revision (See Manual for Details)
Description added
[2] Set the DAOE0 bit ... The output value is expressed by the
following formula:
Figure 19.12 amended
VCC
FWE
MD2 to MD0 *
RES
SWE bit
VCC
FWE
MD2 to MD0 *
RES
SWE bit
Description amended
The operating mode enables or disables the on-chip ROM.
The operating mode is selected by the mode setting pins,
such as the FWE and MD2 to MD0 pins shown in table 3.1. ...
DADR contents
256
1
1
t
t
OSC1
OSC1
t
MDS
Vref
SWE set
SWE set
*
t
MDS
3
t
(1) Boot Mode
Wait time: x
(2) User Program Mode
Wait time: x
MDS
*
3
*
3
Programming/
erasing
possible
Programming/
erasing
possible
Wait time: 100 s
Wait time: 100 s
Min 0 s
SWE cleared
SWE cleared
Min 0 s
Min 0 s

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