HD64F2676VFC33 Renesas Electronics America, HD64F2676VFC33 Datasheet - Page 942

IC H8S MCU FLASH 256K 144-QFP

HD64F2676VFC33

Manufacturer Part Number
HD64F2676VFC33
Description
IC H8S MCU FLASH 256K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheets

Specifications of HD64F2676VFC33

Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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Section 24 Electrical Characteristics
Rev. 3.00 Mar 17, 2006 page 890 of 926
REJ09B0283-0300
Read
Write
Notes:
EDACK0, EDACK1
DACK0, DACK1
A23 to A0
RAS5 to RAS2
UCAS, LCAS
OE, RD
HWR
D15 to D0
UCAS, LCAS
OE
HWR
D15 to D0
WAIT
Tcw :
Tcwp:
DACK and EDACK timing: when DDS = 0 and EDDS = 0
RAS timing: when RAST = 0
Figure 24.18 DRAM Access Timing: Three-State Access, One Wait
Wait cycle inserted by programmable wait function
Wait cycle inserted by pin wait function
Tp
Tr
Tc1
t
WTS
Tcw
t
WTH
t
WTS
Tcwp
t
WTH
Tc2
Tc3

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