HD64F2676VFC33 Renesas Electronics America, HD64F2676VFC33 Datasheet - Page 941

IC H8S MCU FLASH 256K 144-QFP

HD64F2676VFC33

Manufacturer Part Number
HD64F2676VFC33
Description
IC H8S MCU FLASH 256K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2600r
Datasheets

Specifications of HD64F2676VFC33

Core Processor
H8S/2600
Core Size
16-Bit
Speed
33MHz
Connectivity
IrDA, SCI
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
103
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2676VFC33
Manufacturer:
RENESAS
Quantity:
5 530
Part Number:
HD64F2676VFC33
Quantity:
9 520
Part Number:
HD64F2676VFC33
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
HD64F2676VFC33V
Manufacturer:
RENESAS
Quantity:
5 530
Part Number:
HD64F2676VFC33V
Manufacturer:
ROHM
Quantity:
750 000
Part Number:
HD64F2676VFC33V
Manufacturer:
RENESAS
Quantity:
120
Part Number:
HD64F2676VFC33V
Manufacturer:
RENESAS/瑞萨
Quantity:
20 000
Read
Write
EDACK0 to EDACK3
DACK0, DACK1
Notes:
A23 to A0
RAS5 to RAS2
UCAS
LCAS
OE, RD
HWR
D15 to D0
OE, RD
HWR
D15 to D0
AS
Figure 24.17 DRAM Access Timing: Three-State Access (RAST = 1)
DACK and EDACK timing: when DDS = 0 and EDDS = 0
RAS timing: when RAST = 1
t
AD
Tp
t
t
PCH1
AS2
t
CSD2
Tr
t
AH2
t
t
DACD1
EDACD1
t
t
WRD2
t
AD
WDD
Tc1
Rev. 3.00 Mar 17, 2006 page 889 of 926
t
AC7
t
Section 24 Electrical Characteristics
AS3
t
t
WCS2
t
WDS2
OED2
t
AA5
Tc2
t
CASD2
t
WCH2
t
CASW2
t
AC2
t
AH3
t
WDH3
Tc3
REJ09B0283-0300
t
RDS2
t
WRD2
t
RDH2
t
t
OED1
CASD1
t
t
t
DACD2
EDACD2
CSD3

Related parts for HD64F2676VFC33