HD64F2676VFC33 Renesas Electronics America, HD64F2676VFC33 Datasheet - Page 842

• Manufacturer Part Number: HD64F2676VFC33
• Description: IC H8S MCU FLASH 256K 144-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2600r

Specifications of HD64F2676VFC33

• Core Processor: H8S/2600
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: IrDA, SCI
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 103
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 12x10b; D/A 4x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

Section 19 Flash Memory (F-ZTAT Version)
Notes: 1. In boot mode, a part of the on-chip RAM area (H'FF8000 to H'FF87FF) is used by the
Rev. 3.00 Mar 17, 2006 page 790 of 926
REJ09B0283-0300
return when a program that is to be initiated in user program mode was accidentally erased and
could not be executed in user program mode.
2. Boot mode can be cleared by a reset. Release the reset by setting the MD pins, after
3. Do not change the MD pin input levels in boot mode.
4. All interrupts are disabled during programming or erasing of the flash memory.
boot program. Addresses H'FF8800 to H'FFBFFF is the area to which the
programming control program is transferred from the host. The boot program area
cannot be used until the execution state in boot mode switches to the programming
control program.
waiting at least 20 states since driving the reset pin low. Boot mode is also cleared
when the WDT overflow reset occurs.